Akebono Brake Industry Co., Ltd.

Other

Tohoku University

Olympus Corporation

Japan Science and Technology Agency

Ulvac, Inc.

Nihon Inter Electronics Corporation

Nihon Inter Electronic Corporation

Tadao Matsunaga

Yoichi Haga

Masatomo Mori

Masahiro Nezu

Takashi Kunimi

Masayoshi Esashi

Rokurou Naya

Shougo Suzuki

Atsuyoshi Shimamoto

Ken Maehira

Taichi Suzuki

Koh Fuwa

Makoto Ohta

Masanori Mizushima

Yukio Katori

Hiroshi Yoshida

Yasutomo Shimizu

Tetsuaki Kawase

Yasutomo Ohashi

Akihiro Azuma

Kyoichi Akiyama

Katsuhiro Fujita

Noriko Tsuruoka

Soyoka Osaki

Kaihong Yu

Daisuke Yamauchi

Shinichirou Suda

Simon Andre Tupin

Provided is a hollow organ model unit. The hollow organ model unit includes a base that includes a recessed part, a hollow organ model that is placed in the recessed part, a filler that is filled in the recessed part, and a sensor that performs a measurement on the hollow organ model.

Hollow organ model unit and method for manufacturing hollow organ model unit

A cochlear implant insertion-assisting device includes a tubular member configured to hold a cochlear implant. The tubular member includes a cut extending in a longitudinal direction. The cochlear implant insertion-assisting device can selectively switch between a first state in which the cochlear implant is held and a second state in which the cochlear implant can be released.

Mechanism for holding elongate medical apparatus

A ultrasound probe according to this invention is provided with: a first dry film resist having a plurality of first apertures formed in an array shape, and respectively supporting the piezoelectric elements in close contact with a rim part of each of the first apertures in a state of partly exposing the function elements; a second dry film resist laminated on the first dry film resist, and also having second apertures respectively enclosing each of the function elements, the second dry film resist being of a thickness equivalent to that of each of the function elements; and a third dry film resist laminated on the second dry film resist, and also having third apertures, and respectively sandwiching each of the piezoelectric elements with the first dry film resist in a state of partly exposing the piezoelectric elements in close contact with a rim part of each of the third apertures.

Device, method of manufacturing the device, and method of manufacturing array type of ultrasound probe

An optical scanning apparatus for efficiently performing scanning with light by efficiently increasing amplitude of an emission end of an optical fiber is provided. The optical scanning apparatus includes an optical fiber that guides illumination light emitted from a light source so that the illumination light is emitted from the emission end, a magnetic body fixed to the optical fiber, and a magnetic field generating unit changing a magnetic field to act on the magnetic body to displace a position of the emission end in a radial direction by magnetic force, and the magnetic field generating unit includes a plurality of coils for individually generating magnetic fields acting on the magnetic body at positions separate from each other in a longitudinal direction of the optical fiber, and the magnetic fields acting on the magnetic body can be individually adjusted at the positions.

Optical scanning apparatus

An insertion device and an endoscope which are inserted and extracted through a small incision and have multiple functions. A device body has grip forceps as a treatment means. A first folding back section and a second folding back section are provided at a distal portion of the device body such that the first and second folding back sections are aligned in a row in the longitudinal direction of the device body. The first folding back section and the second folding back section respectively have image obtaining means. An operation means can move the first folding back section to a folded back position in which the first folding back section is folded back relative to the second folding back section, and can also move the second folding back section to a position in which the second folding back section is folded back relative to the device body.

Insertion device and endoscope

A driving mechanism using shape memory alloys comprises a first and a second shape memory alloys coils (), a pin-like drive member () connected to each of the shape memory alloys coils () extending in the axis direction, a substrate () having a wiring pattern () and a drive circuit () to supply current to the shape memory alloys coils (), and a magnetic latch part () to hold the drive member (), and the magnetic latch part () has a latch position in the axis direction of the drive member (), the drive circuit () selectively current-drives the first and the second shape memory alloys coils (), the driven first or second shape memory alloys coils () is heated and compressed to move the drive member () in the axis direction, and magnetic bodies () provided to the drive member () is magnetically fixed at the latch position, thereby fixed and held in the axis direction.

Driving mechanism using shape memory alloys including a magnetic latch

Semiconductor acceleration sensor and its self-diagnosing method

A semiconductor acceleration sensor including a central board having a movable electrode section, an outside board having a stationary electrode section, and a sealing insulating section for joining the central board and the outside board which are laminated on each other, wherein the sealing insulating section has a conductive layer, and the conductive layer is a sealing member or an anodic bonding electrode.

Semiconductor acceleration sensor and manufacturing method thereof

An acceleration sensor includes a first substrate, a second substrate and a third substrate. The second substrate has a through-hole, a first contact formed on an inner surface of the through-hole, and a first bonding pad connected to the first contact. An electrically conductive ball is accommodated in the through-hole. The third substrate has a recess, a second contact formed in the recess contacting the bottom of the electrically conductive ball, and a second bonding pad connected to the second contact.

Acceleration sensor and method for manufacturing thereof

A semiconductor acceleration sensor comprising a rectangular semiconductor substrate on the moving electrode side and a rectangular semiconductor substrate on the fixed electrode side laminated on each other, the moving electrode side substrate being formed with a heavy weight and a thin cantilever, a moving electrode being provided on the heavy weight, a first electrostatic attraction electrode being provided on the cantilever, the fixed electrode side substrate being formed with a fixed electrode at a position opposed to the moving electrode and a second electrostatic attraction electrode at a position opposed to the electrostatic attraction electrode. The first and second electrostatic attraction electrodes are placed facing each other. A predetermined spacing is provided between the electrostatic attraction electrodes and a predetermined voltage is applied therebetween.

Semiconductor acceleration sensor using semiconductor microworking

In a semiconductor acceleration sensor, a weight and thin beam parts adjacent to the weight are formed on a substrate, a moving electrode is formed on the weight, and a fixed electrode is formed at a position of the other substrate opposed to the moving electrode. Both the electrodes come in contact with each other and conduct as a result of acceleration on the weight, whereby the semiconductor acceleration sensor operates. The fixed electrode or the moving electrode is formed with a projection toward the opposed electrode and the projection and the electrode come in contact with each other and conduct by action of acceleration with a predetermined spacing held between both the electrodes for preventing occurrence of chattering caused by the electrostatic attraction force between both the electrodes.

Semiconductor acceleration sensor

An acceleration sensor is based on a semiconductor technique which is suitable for mass production. The resulting acceleration sensor is small in size and high in precision. The acceleration sensor includes a stationary section, an acting section to which a force is applied in response to acceleration, a flexible section through which the stationary section is coupled to the acting section, a plurality of distortion sensing elements coupled to the flexible section, a first weight having a bottomed hole which is gradually smaller in width towards the bottom of the hole, the first weight being coupled to the acting section and a second weight, greater in specific gravity than the first weight, coupled to the bottom of the hole of the first weight.

Acceleration sensor

Growing community of inventors

Miyagi, Japan

Tadao Matsunaga