Nichia Corporation

Nichsa Corporation

Tadao Hayashi

Hiroto Tamaki

Teruhito Azuma

Takuya Nakabayashi

Ryo Suzuki

Takeshi Ikegami

Tsuyoshi Okahisa

Suguru Beppu

Kunihiro Izuno

Toru Hashimoto

Ryohei Yamashita

Tadaaki Ikeda

Yusaku Achi

Daisuke Oyamatsu

Takafumi Sugiyama

Mamoru Imada

Takayoshi Wakaki

Yoshiki Sato

Daisuke Kasai

Takao Kosugi

Shoji Hosokawa

Tomoya Tsukioka

Yasunori Shimizu

Yoshikazu Takeuchi

Yoshiharu Nagae

A light emitting module includes a light guide plate including a first face, a second face opposing the first face, and a through part penetrating between the first face and the second face, a light emitting device disposed in the through part on a second face side, a light transmissive member disposed on the light emitting device in the through hole on a first face side and between the light emitting device and a lateral wall of the through part, and a first light reflecting member disposed between an upper face of the light emitting device and the light transmissive member while being in contact with the upper face of the light emitting device.

Light emitting module and method of manufacturing same

A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.

Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device

A method of manufacturing a light emitting device includes: providing two light emitting elements disposed on a first surface of a light transmissive member; disposing a light guide member covering a part of the first surface of the light transmissive member, and lateral surfaces of the two light emitting elements; disposing a light reflective member covering the two light emitting elements, a second surface of the light transmissive member, and the light guide member, the second surface of the light transmissive member being opposite to the first surface; and cutting the light reflective member and/or the light transmissive member between the two light emitting elements.

Method of manufacturing light emitting device

A light-emitting module includes a light-emitting element unit including a light-emitting element, a light-transmissive member covering a main light-emitting surface of the light-emitting element, and a first light-reflective member covering lateral surfaces of the light-emitting element; a light-transmissive light-guiding plate having a first main surface and a second main surface having a recess accommodating the light-emitting element unit; a second light-reflective member covering the second main surface and the light-emitting element unit; and a light-transmissive bonding member disposed in contact with inner lateral surfaces of the recess and outer lateral surfaces of the light-emitting element unit. At least a portion of the first light-reflective member is located outside the recess in a cross-sectional view, and is in contact with the light-transmissive bonding member. The light-transmissive bonding member has an inclined surface forming an acute angle with a corresponding outer lateral surface of the first light-reflective member.

Light-emitting module

A light emitting device includes: a light emitting element comprising: a semiconductor multilayer structure that has an electrode formation surface, a light-emitting surface opposite to the electrode formation surface, and side surfaces between the electrode formation surface and the light-emitting surface, and a pair of electrodes provided on the electrode formation surface; a covering member covering the side surfaces of the light emitting element; and an optical member disposed over the light-emitting surface of the light emitting element and an upper surface of the covering member, the optical member comprising: a light-reflective portion disposed above the light emitting element, and a light-transmissive portion disposed between the light-reflective portion and the covering member and forming a part of an outer side surface of the light emitting device.

Light emitting device including covering member and optical member

A method of manufacturing a light emitting device includes: providing a light emitting element including a light extraction surface, an electrode-formed surface on a side opposite to the light extraction surface, lateral surfaces positioned between the light extraction surface and the electrode-formed surface, and a pair of electrodes on the electrode-formed surface; providing a covering member including a lens portion and a first recess on a side different from the lens portion; disposing the light emitting element on a bottom surface of the first recess, with the light extraction surface and the bottom surface of the first recess facing each other; and forming a reflective member in the first recess to cover the lateral surfaces of the light emitting element while at least a part of the pair of electrodes is exposed from the reflective member.

A light emitting module with a reduced thickness is provided. A method of manufacturing a light emitting module sequentially includes: providing a light guiding plate having a first main surface being a light emitting surface, and a second main surface on the side opposite to the first main surface; providing a plurality of light emitting elements on the light guiding plate; and forming a wiring electrically connecting the plurality of light emitting elements. A light emitting module includes: a light guiding plate having a first main surface and a second main surface; a plurality of wavelength conversion parts disposed at the second main surface of the light guiding plate so as to be spaced apart from each other; a plurality of light emitting elements respectively bonded to the plurality of wavelength conversion parts; and a wiring connected to the plurality of light emitting elements.

Method of manufacturing light emitting module and light emitting module

A method for manufacturing a light emitting device includes: forming a first reflector that covers outer peripheral faces of a light transmissive member; forming a light guiding member covering at least a portion of the light transmissive member, a portion of a lower face of the first reflector, and at least some portions of lateral faces of a light emitting element disposed under the light transmissive member; and forming a second reflector covering a portion of the lower face of the first reflector that is exposed from the light guiding member and located outward of the light guiding member.

Method for manufacturing light emitting device including first and second reflectors

A method of manufacturing a light emitting module according to the present disclosure includes: preparing a light guide plate that comprises a first main surface serving as a light-emitting surface and a second main surface opposite to the first main surface; respectively providing light emitting elements on the second main surface so as to correspond to each of a plurality of optically functional portions provided on the first main surface of the light guide plate; and forming wires electrically connecting the plurality of light emitting elements.

Provided is a linear light source including: a light-transmissive base having a first main surface that has a rectangular shape with long sides and short sides, a second main surface located opposite to the first main surface, a first (long) side surface, and a second (short) side surface; a plurality of light emitting devices, each including a light emitting element, a light-transmissive member and a sealing member. An upper surface of each of the light emitting devices includes an upper surface of the light-transmissive member. A first bonding member bonds the first main surface of the light-transmissive base and the upper surfaces of the light emitting devices. A width of the light-transmissive base is the same as a width of the light emitting devices in a first direction orthogonal to a first side surface of the light-transmissive base.

Linear light source and planar light emitting device

A composite board is provided with a board and a covering member. The board includes a base made of ceramics, first wiring provided on an upper surface of the base, and second wiring provided on a lower surface of the base and electrically connected to the first wiring. The covering member covers the base such that the first wiring and the second wiring are exposed.

Composite board, light-emitting device, and manufacturing method of light-emitting device

A light emitting device including a light emitting element, a light transmissive member, a light guide member, and a light reflective member. The light transmissive member is disposed on an upper surface of the light emitting element, and has a lower surface including a first region facing the light emitting element and a second region positioned outside of the first region. The light guide member covers a lateral surface of the light emitting element and the second region of the lower surface of the light transmissive member. The light reflective member covers the light emitting element, an upper surface of the light transmissive member and the light guide member. One of lateral surfaces of the light transmissive member is exposed from the light reflective member.

Growing community of inventors

Tokushima, Japan

Tadao Hayashi