Canon Kabushiki Kaisha

Tadanori Suto

Hiroyuki Morimoto

Riichi Saito

Susumu Kadokura

Yoshiaki Tomari

Tomoaki Kato

Manabu Takayama

Tadayoshi Muta

Jin Tachikawa

Junichi Sakamoto

Kenichi Iwata

Shigeru Yoshimura

Nagato Osano

Naoki Shirai

A semiconductor substrate includes a via-hole that extends from a first surface to a second surface. An electrode pad layer that serves as the bottom of the via-hole is disposed on the second surface. An insulating layer is formed on the first surface of the semiconductor substrate and the sidewall of the via-hole. A metal layer is formed on the first surface of the semiconductor substrate and the sidewall of the via-hole with the insulating layer interposed therebetween and is directly formed on the bottom of the via-hole. An inclined surface is formed on the sidewall of the via-hole such that the bottom of the via-hole has a smaller opening size than the open end of the via-hole. The inclined surface has asperities.

Semiconductor device and method for manufacturing semiconductor device

The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

Semiconductor device and method of manufacturing semiconductor device

A method of drying a resinous composition layer, comprises the steps of coating a resinous composition over a substrate and drying the resinous composition layer to be dried. The drying method is a vacuum dry. And a drying condition in that case is such that an exhaustion is performed taking over 6 sec. till a degree of vacuum comes to 100 Torr.

Method of drying resinous composition layer, method of manufacturing color filter substrate using the same drying method, and liquid crystal display device

A delivery member has a substrate material, a first coating film containing a filler and formed by electrodeposition on a substrate material, and a second coating film composed of an organic coating film formed on the first coating film.

Delivery member, and apparatus employing the same

A delivery member has a substrate and, provided thereon, an eletro-deposition coating film containing an organic powder. By this configuration, a delivery member having a homogeneous coating is formed. Stress is therefore uniformly distributed and the coating is resistant to wear. The delivery member can be made in a variety of different forms and can be used in many different types of apparatus.

Delivery member and apparatus making use of the same

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Tokyo, Japan

Tadanori Suto