Hd Microsystems, Ltd.

Tadamitsu Nakamura

Masato Nishimura

Daisaku Matsukawa

Ayaka Azuma

Kazuya Soejima

Satoshi Abe

A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, &#x2014;O&#x2014;, or &#x2014;SO&#x2014;, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), Ris independently a hydrogen atom or a group represented by &#x2014;CH&#x2014;O&#x2014;R. At least one of the plurality of Rs is a group represented by &#x2014;CH&#x2014;O&#x2014;R. Ris independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. 

Positive-type photosensitive resin composition

A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below, and the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, &#x2014;O&#x2014;, or &#x2014;SO&#x2014;, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. 

Provided is a photosensitive resin composition containing; (A) a polymer having an acidic functional group or a substituent derived therefrom; (B) a photoreactive compound; (C) a solvent; and (D) a nitrogen-containing aromatic compound represented by the following general formula (1). 

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Hitachi, Japan

Tadamitsu Nakamura