Murata Manufacturing Co., Ltd.

Tadamasa Miura

Shinichiro Nawai

Hiroshi Ikeda

Atsushi Kishimoto

Takuo Wakaoka

Kazuto Miyagawa

Kiyohiro Koto

Akihito Naito

Yoshiyuki Yamashita

Shuichi Kawata

Yuki Yamamoto

Hironao Ogura

Eisuke Tashiro

A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.

Sheet-shaped heat pipe

A temperature detector is configured to detect the temperature of a housing while in contact with the housing, and a spring pin is in contact with the temperature detector in a separable manner. Thus, at mounting of the temperature detecting device on an electronic device, it is possible to fix the temperature detector to the housing, and the spring pin to a circuit board of the electronic device. At disassembly of the electronic device, it is easy to separate the spring pin from the temperature detector by removing, from the housing, the spring pin together with the circuit board. At assembly of the electronic device, it is easy for the spring pin to contact the temperature detector by attaching, to the housing, the spring pin together with the circuit board.

Temperature detecting device and electronic device

Provided is an electronic apparatus that makes it possible to improve a heat transfer property from a heat generating element to a heat storage material. The electronic apparatus is provided with a heat generating element and a heat storage device for storing heat generated by the heat generating element. The heat storage device includes a reaction chamber containing a heat storage material for absorbing the heat generated by the heat generating element. The reaction chamber is defined by a first surface, a second surface opposed to the first surface, and a plurality of side surfaces connecting the first surface with the second surface. In the reaction chamber, a thermal conductivity of a peripheral part is smaller than a thermal conductivity of a central part of the reaction chamber.

Electronic apparatus

An electronic component in which a metal layer is unlikely to be peeled from a substrate includes an insulating ceramic substrate, a ceramic layer diffusion-bonded to the substrate, a metal layer including a first principal surface and a second principal surface opposed to the first principal surface, with the first principal surface diffusion-bonded to the ceramic layer, and a characteristic layer diffusion-bonded to the second principal surface of the metal layer and prepared from a ceramic material, wherein the characteristic layer varies in resistance value with respect to ambient temperature or applied voltage.

Electronic component

In order to further improve stress tolerance, a thermistor device includes a first base material member made of resin, a thermistor element including a thermistor thin film provided on a metal base material and first and second external electrodes provided on the thermistor thin film, and a first lead electrode and a second lead electrode provided on a principal surface of the first base material member, and connected to the first external electrode and the second external electrode. Each of the metal base material and the thermistor thin film undergoes a deflection between the first external electrode and the second external electrode.

Thermistor device

A NTC thermistor element that includes a substrate composed of a ceramic material containing Mn, Ni, Fe and Ti; and a pair of external electrodes on the substrate. When the molar amount of Mn in the substrate is a [mol %] and the molar amount of Ni in the substrate is b [mol %], a and b satisfy a+b=100, 44.90&#x2266;a&#x2266;65.27 and 34.73&#x2266;b&#x2266;55.10. When the molar amount of Fe is c [mol %] and the molar amount of Ti is d [mol %], c and d satisfy 24.22&#x2266;c&#x2266;39.57 and 5.04&#x2266;d&#x2266;10.18 based on a+b=100.

NTC thermistor element and method and method for producing the same

An electronic-component mounting structure includes an electronic component which includes a metal substrate, a semiconductor ceramic layer located on the metal substrate, a pair of split electrodes located on the semiconductor ceramic layer, and plating films located on the split electrodes and the metal substrate, and a mounting body on which lands to be connected to the respective split electrodes of the electronic component are provided. The position of a peripheral end portion of each land to be connected to the corresponding split electrode is located farther inside than the position of a peripheral end portion of the split electrode. In addition, a plane area of the land is smaller than that of the split electrode.

Electronic-component mounting structure

A thermistor includes a metal substrate, a semiconductor ceramic layer on the metal substrate, and a pair of split electrodes on the semiconductor layer. The semiconductor ceramic layer is formed by a solid-phase method. The metal substrate includes ceramic particles and is not interrupted in the direction of thickness by the ceramic particles or a pillar defined by a chain of the ceramic particles. Preferably, the metal substrate and the ceramic layer of the thermistor have a thickness of about 10 &#x3bc;m to about 80 &#x3bc;m and about 1 &#x3bc;m to about 10 &#x3bc;m, respectively.

Electronic component package structure

A gas sensor having high detection sensitivity and a low output signal noise includes a laminate of thermistor ceramic, a catalytic electrode, an internal electrode, and external electrodes. When coming into contact with a detection target gas, the catalytic electrode generates heat, and the resistance of a thermistor layer of a sensing portion is decreased. Since the heat generated by the catalytic electrode is directly transferred to the thermistor layer without passing through an insulating layer or the like, high detection sensitivity is obtained. In addition, the structure can be formed in which heat of the sensing portion is insulated by a hollow portion and heat diffusion is prevented, so that the heat capacity of the sensing portion is further decreased.

Gas sensor

A semiconductor ceramic composition for use as a component of the body of NTC thermistors contains at least manganese and cobalt as main ingredients and both aluminum and titanium as additional ingredients for resistance adjustment by annealing. It becomes easier to adjust the resistance of the composition by annealing when the titanium content is equal to or lower than about 9.2 parts by weight on a TiObasis relative to 100 parts by weight of the main ingredients.

Semiconductor ceramic composition for NTC thermistors

A semiconductor ceramic element includes an element main body where a PTC section including a semiconductor ceramic which has PTC characteristics and an NTC section including a semiconductor ceramic which has NTC characteristics are integrated by co-firing while suppressing interdiffusion. The element main body is formed in such a way that a PTC substrate is first obtained by firing a semiconductor ceramic material to serve as the PTC section at a predetermined temperature, and a paste containing a semiconductor ceramic material to serve as the NTC section is then applied or printed on the PTC substrate, followed by co-firing at a temperature lower than the predetermined temperature.

Semiconductor ceramic element and method for producing same

An NTC thermistor having a metal base material, a thermistor film layer formed on the metal base material, and a pair of split electrodes formed on the thermistor film layer. A ceramic slurry is applied onto a carrier film to form the thermistor film layer, a metal powder containing paste is applied onto the thermistor film layer to form the metal base material, and further an electrode paste is applied onto the metal base material to form the split electrodes. Thereafter, the three substances are integrally fired.

Thermistor and method for manufacturing the same

A thermal sensor that includes a ceramic body formed of NTC thermister ceramic, heat sensing part electrodes, temperature compensation part electrodes, external electrodes, and a cavity. A heat sensing part, which is the surface layer of the ceramic body, is heated by, for example, radiant heat transfer, reducing the resistance value of a thermister ceramic layer between the heat sensing part electrodes. Since the heat of the heat sensing part of the ceramic body is insulated by the cavity and thus prevented from diffusing, the heat capacity of the heat sensing unit is reduced, obtaining high sensitivity and high responsiveness.

Thermal sensor, non-contact thermometer device, and non-contact temperature measurement method

A NTC thermistor which has superior linearity of resistance-temperature characteristic is provided without depending on a combination of two or more kinds of material but with a single semi-conductive ceramic material. As the semi-conductive ceramic material of negative resistance-temperature characteristic is a ceramic body constituting a NTC thermistor being an oxide expressed by the formula AMnOin which y is 0.8 to 1.6, A is a combination of rare earth element and barium and the content of barium in A is 60 to 75 mol % when y=0.8 to 1.5, and 50 to 63 mol % y=1.7 to 2.3, and z is a value which maintains the electric neutrality of the oxide. A preferable oxide is of the formula (LaBa)MnOin which when y=0.8 to 1.5, 0.60&#x2266;&#x3b1;&#x2266;0.75, and when y=1.7 to 2.3, 0.50&#x2266;&#x3b1;&#x2266;0.63.

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Nagaokakyo, Japan

Tadamasa Miura