Ebara Corporation

Tadakazu Sone

Hideo Aizawa

Ryuichi Kosuge

Hiroshi Sotozaki

Masao Umemoto

Hiroshi Aono

Kenji Shinkai

Hiroyuki Shinozaki

Itsuki Kobata

Pohan Chen

Norio Kimura

Manabu Tsujimura

Toru Maruyama

Yasuyuki Motoshima

Takashi Yamazaki

Nobuyuki Takahashi

Kenichi Suzuki

Hozumi Yasuda

Hisanori Matsuo

Seiji Katsuoka

Toshio Yokoyama

Tatsuya Sasaki

Kenichiro Saito

Soichi Isobe

Yoichi Shiokawa

Katsutoshi Ono

Shunichiro Kojima

Hiroomi Torii

Takuji Hayama

Tomohiko Akatsuka

Masayoshi Ito

Takuya Moriura

Takuji Kobayashi

Tetsuya Terada

Masaaki Eriguchi

There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.

Apparatus for polishing, processing system, and method of polishing

An operation control unit includes a storage device storing a program which includes commands of: obtaining a correlation between a supply position of the polishing liquid in the radial direction of the polishing pad using the liquid injection nozzle and an average polishing rate of the substrate and an distribution of the polishing rate within the substrate; determining a movable range of the liquid injection nozzle according to a predetermined range of an allowable average polishing rate and the correlation between the supply position of the polishing liquid and the average polishing rate; determining an optimal supply position of the polishing liquid from the correlation between the supply position of the polishing liquid and the distribution of the polishing rate within the substrate within the determined movable range of the liquid injection nozzle; and moving the liquid injection nozzle to the determined supply position to polish the substrate.

Polishing device, polishing method, and recording medium for recording program for determining supply position of polishing liquid

A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and a liquid supply mechanism configured to supply a liquid onto the polishing pad. The liquid supply mechanism includes a nozzle arm configured to be movable in a radial direction of the polishing table, and a liquid ejection nozzle attached to the nozzle arm. The liquid ejection nozzle is a fan-shaped nozzle having a liquid throttle surface having a tapered shape.

Polishing apparatus

An object of the present invention is to reduce an amount of use of the polishing liquid. There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including: a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable; a substrate holding unit configured to hold the object to be polished and press the object against the polishing pad; a supplying device for supplying polishing liquid to the polishing surface in a state in which the supplying device is pressed against the polishing pad; and a pressing mechanism configured to press the supplying device against the polishing pad, in which the pressing mechanism is capable of respectively adjusting pressing forces for pressing the sidewalls of on the upstream side and the downstream side of the supplying device against the polishing surface.

Apparatus for polishing and method for polishing

Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

Polishing apparatus and polishing method

A substrate polishing apparatus includes a polishing tablehaving a polishing surfacein the upper surface, a substrate holding portionthat holds a substrate W having a surface to be polished in the lower surface, and a holding portion coverthat covers the outer side of the substrate holding portion. Between the lower portion of the holding portion coverand the upper surface of the polishing table, a gap portion for intakeis provided, and in the upper portion of the holding portion cover, a pipe for exhaustconnected to an exhaust mechanismis provided. By operating the exhaust mechanism, a rising air current from the gap portiontoward the pipeis formed between the outer surface of the substrate holding portionand the inner surface of the holding portion cover

Substrate polishing apparatus

There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable, a substrate holding unit configured to hold the object to be polished and pressing the object to be polished against the polishing pad, and a polishing-liquid removing unit configured to remove polishing liquid from the polishing surface. The polishing-liquid removing unit includes a rinse unit configured to jet cleaning liquid onto the polishing surface and a sucking unit configured to suck the polishing liquid on the polishing surface onto which the cleaning liquid is jetted. The rinse unit includes a cleaning space surrounded by a sidewall. The sidewall includes an opening section for opening the cleaning space toward a radial direction outer side of the polishing table.

A method, which can accurately determine in a short time a relationship between a load of a dresser and a pressure of a gas supplied to an air cylinder, is disclosed. The method includes determining a first contact point where a load measurement device is brought into contact with a polishing table, calculating a relational expression composed to a quadratic function showing a relationship between a measured load and a measured pressure, determining a second contact point where the dresser is brought into contact with a polishing surface of a polishing pad, calculating an amount of correction from the pressure of the gas at the first contact point and the pressure of the gas at the second contact point, and correcting the relational expression based on the calculated amount of correction.

Calibration method and non-transitory computer-readable storage medium storing a program of calibration

Disclosed is a turntable cloth peeling jig including: a cylindrical winding cylinder including a slit formed on an outer periphery of the cylindrical winding cylinder and extending in an axial direction thereof; a cloth clamping member disposed inside the winding cylinder and configured to clamp an outer peripheral edge of a cloth inserted into the slit; an extension bar attached to one end portion of the winding cylinder so as to extend coaxially therewith; an engaging portion provided at a tip end portion of the extension bar and engaged with a rotation jig configured to rotate the winding cylinder; and a handle provided in the engaging portion and configured to support the winding cylinder when rotating the rotating jig.

Turntable cloth peeling jig

The invention suppresses generation of noises attributable to rotation of a rotary joint. A rotary joint includes a rotating body that rotates on a rotating axis A, a housing disposed so as to surround the rotating body, and at least one bearing disposed between the rotating body and the housing and adapted to support rotation of the rotating body. The rotary joint supplies fluids through fluid connection ports formed in the housing and fluid passages formed inside the rotating body to a polishing table having attached thereto a polishing pad for polishing a substrate or a holding portion that is adapted to hold the substrate while pressing the substrate against the polishing pad. At least one elastic member is interposed at least either between the rotating body and the at least one bearing or between the housing and the at least one bearing.

Rotary joint and polishing apparatus

There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on the top portion of the cover.

Cover for component of polishing apparatus, component of polishing apparatus, and polishing apparatus

A lifting deviceincludes a lifting mechanismand an adjustment member. The lifting mechanismis provided between at least one of a plurality of units of a substrate processing apparatus and an installation surface of the unit, and adjusts height of the at least one unit with respect to the installation surface. The adjustment memberis provided with an extended sectionextended from the lifting mechanism, and is capable of operating the lifting mechanismthrough the extended section

Lifting device, substrate processing apparatus having lifting device, and unit transferring method

There is provided a polishing apparatus capable of detecting uneven wear occurring on a polishing pad and detecting an appropriate replacement timing of the polishing pad. The polishing apparatus detects, every predetermined time, a value of rotation speed or a value of rotation torque of a table drive shaft for rotationally driving a polishing table or a dresser drive shaft for driving a dresser, or a value of swing torque of a dresser swing shaft for driving the dresser; calculates a change quantity thereof based on the value of the detected rotation speed, the value of the detected rotation torque, or the value of the detected swing torque; determines whether or not the change quantity exceeds a predetermined value; and notifies a user of a warning when a determination is made that the change quantity exceeds the predetermined value.

Growing community of inventors

Tokyo, Japan

Tadakazu Sone