Murata Manufacturing Co., Ltd.

Tadaji Takemura

Syuji Yamato

Takanori Uejima

Morio Takeuchi

Hiromichi Kawakami

Syuichi Onodera

Yasushi Okumura

A multilayer circuit boardincludes a core substrate; a resin section, which covers the side surface and a lower surfaceof the core substrate; and a plurality of metal pins, which are disposed within the resin section. The core substrateincludes a ceramic multilayer section, which is disposed on the mother-substrate side of the core substrate; and a resin multilayer section, which is stacked on a main surfaceon a side of the ceramic multilayer section, the side being opposite to the mother substrate. The resin sectionincludes the plurality of metal pins, and a through-hole, which extends through the resin sectionin its thickness direction. A fastening partpenetrates the through-hole, to mount the multilayer circuit boardon the mother substrate.

Multilayer circuit board used for probe card and probe card including multilayer circuit board

An electronic component element includes a piezoelectric substrate and a comb-shaped electrode located on one principal surface of the piezoelectric substrate. A support layer is arranged around the comb-shaped electrode. A cover layer is disposed so as to cover the support layer and the comb-shaped electrode. Via-hole electrodes extend through the cover layer and are connected to the comb-shaped electrode. An uneven portion is located on a principal surface of the cover layer that is opposite to a principal surface of the cover layer that is opposed to the comb-shaped electrode.

Electronic component element and composite module including the same

A method of manufacturing a composite module prevents a connection electrode electrically coupled to a functional element from separating from a first principal surface of an element substrate. A transmission filter element, a reception filter element, connection electrodes electrically coupled to the transmission filter element and the reception filter element, and an insulating layer surrounding the transmission filter element, the reception filter element, and the connection electrodes are disposed on a first principal surface of an element substrate. The insulating layer covers at least a portion of the surface of each of the connection electrodes. Because the portion of the surface of each of the connection electrodes in an exposed state is covered with the insulating layer, the connection electrodes electrically coupled to the transmission filter element and the reception filter element are prevented from separating from the first principal surface of the element substrate.

Electronic component, method of manufacturing same, composite module including electronic component, and method of manufacturing same

A surface acoustic wave device includes a piezoelectric substrate including an interdigital transducer located on one principal surface thereof, an insulating layer arranged around the interdigital transducer, a cover layer arranged over the insulating layer and the interdigital transducer, and a columnar electrode penetrating through the insulating layer and the cover layer, and connected to the interdigital transducer through a connection wiring, wherein a buffer layer is arranged on the other principal surface of the piezoelectric substrate.

Surface acoustic wave device and composite module including same

A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.

High-frequency module

A circuit module includes a duplexer mounted on a module board and a cover layer is stacked on an insulating layer that is disposed on one principal surface of a device board so as to enclose a predetermined area thereof. A transmission filter device and a reception filter device that have different transmission bands are provided on the one principal surface of the device board in the predetermined area thereof within the space enclosed by the insulating layer between the device board and the cover layer. Accordingly, the duplexer does not include a package board as in the existing technique, and in turn a circuit module including the duplexer mounted on the module board is significantly reduced in height and in size.

Circuit module including duplexer

In a substrate that improves isolation characteristics of a high-frequency-side signal path and a low-frequency-side signal path, a duplexer, and a substrate module, a package substrate includes two SAW filters mounted thereon and defines a portion of the duplexer. A substrate body includes main surfaces that oppose each other. Land electrodes are provided on one of the main surfaces and are used to connect either of the two SAW filters. Land electrodes are provided on one of the main surfaces and are used to connect a mounting substrate on which the duplexer is mounted and are respectively superposed with the land electrodes when viewed in plan from a z-axis direction. The land electrodes and the land electrodes, which are superposed with each other when viewed in plan from the z-axis direction, are electrically connected to each other.

Substrate, duplexer and substrate module

In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.

Circuit module

A crystal oscillation device includes a crystal oscillator including a package with first connecting electrodes provided on a flat bottom surface mounted on a flat, thin circuit board. Circuit components and second connecting electrodes provided in one-to-one correspondence with the first connecting electrodes are mounted on one principal surface of the circuit board. The crystal oscillator is supported by top surfaces of a transistor and a varicap diode that are the highest among the circuit components mounted on the circuit board. The crystal oscillator and the circuit board are electrically connected with solder provided between the first and second connecting electrodes. The solder also attracts the crystal oscillator toward the circuit board.

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Nagaokakyo, Japan

Tadaji Takemura