Fujitsu Corporation

Fujitsu Semiconductor Limited

Tadahiro Okamato

Hirohisa Matsuki

Mitsutaka Sato

Yoshitaka Aiba

A semiconductor device includes a first semiconductor chip () having a first terminal () on one surface, a second semiconductor chip () which is larger than the first semiconductor chip () and on which the first semiconductor chip () is stacked and which has a second terminal () on one surface, an insulating layer () formed on a second semiconductor chip () to cover the first semiconductor chip (), a plurality of holes () formed in the insulating layer () on at least a peripheral area of the first semiconductor chip (), a via () formed like a film on inner peripheral surfaces and bottom surfaces of the holes () and connected electrically to the second terminal () of the second semiconductor chip (), a wiring pattern () formed on an upper surface of the insulating layer (), and an external terminal () formed on the wiring pattern ().

Growing community of inventors

Kawasaki, Japan

Tadahiro Okamato