Tomoegawa Paper Co., Inc.

Tadahiro Oishi

Hitoshi Narushima

Yoshikazu Tsukamoto

Atsushi Koshimura

Akinori Sei

Takashi Shiozawa

Akira Tezuka

Shouji Aoki

An adhesive for semiconductor device, comprising (a) a polyamide resin having an amine value of 20 to 60 and a weight average molecular weight of 1,000 to 5,000 and (b) a phenolic compound having a weight average molecular weight of 2,000 or less and having a skeleton containing at least 2 methylol groups.

Adhesive for semiconductor devices and adhesive tape using the adhesive

An adhesive for bonding a reinforcing sheet to a lead-formed surface of a tape carrier package used for forming a semiconductor device, the adhesive being a resin composition which constitutes an interlayer between the lead-formed surface and the reinforcing sheet, comprises a polyamide resin having an amine value of 3.0 to 50 and an epoxy resin, is free from peeling and foaming, undergoes sufficient softening and curing at a temperature lower than about 150.degree. C., has high insulation reliability after cured, and has heat resistance against a temperature up to 260.degree. C.

Adhesive for semiconductor device and reinforcing material using the same

This invention relates to an adhesive tape for tape automated bonding (TAB). A first type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by comprising at least resol-type phenol resin and polyamide resin, wherein from 2 to 35% of said resol-type resin is contained in the adhesive layer. A second type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by having at least two layers: one comprising at least polyamide resin and being laminated on one surface of said organic-insulating film and; other comprising at least polyamide resin and resol-type resin and being laminated on other surface of said protective film.

Adhesive tapes for tape automated bonding

Growing community of inventors

Shizuoka, Japan

Tadahiro Oishi