Fujifilm Corporation

Tadahiro Odani

Hidenori Takahashi

Kaoru Iwato

Michihiro Shirakawa

Keita Kato

Atsushi Nakamura

Ryosuke Ueba

A pattern forming method contains: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.

Pattern forming method, multi-layered resist pattern, multi-layered film for organic solvent development, resist composition, method for manufacturing electronic device, and electronic device

There is provided a pattern forming method comprising: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.

A pattern forming method contains: (i) a step of forming a bottom anti-reflective coating on a substrate by using a first resin composition (I), (ii) a step of forming a resist film on the bottom anti-reflective coating by using a second resin composition (II), (iii) a step of exposing a multi-layered film having the bottom anti-reflective coating and the resist film, and (iv) a step of developing the bottom anti-reflective coating and the resist film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.

Pattern forming method, multi-layered resist pattern, multi-layered film for organic solvent development, manufacturing method of electronic device, and electronic device

Provided is a pattern forming method including, in the following order: (1) forming a resist film on a substrate; (2) exposing the resist film, and thereby forming a first line-and-space latent image; (3) subjecting the resist film in which the first line-and-space latent image has been formed, to a first heating treatment; (4) exposing the resist film that has been subjected to the first heating treatment, and thereby forming a second line-and-space latent image, so that the line direction in the second line-and-space latent image intersects the line direction in the first line-and-space latent image; (5) subjecting the resist film in which the second line-and-space latent image has been formed, to a second heating treatment; and (6) developing the resist film that has been subjected to the second heating treatment, using a developer containing an organic solvent.

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Shizuoka, Japan

Tadahiro Odani