Miraial Co., Ltd.

Tokyo Electron Limited

Kakizaki Manufacturing Co., Ltd.

Tadahiro Obayashi

Chiaki Matsutori

Yukihiro Hyobu

Takaharu Oyama

Shuji Akiyama

Toshihiko Iijima

Koichi Nishizaka

Yoichi Emura

The attaching-and-detaching operation of a lid unit is automated using an existing attaching-and-detaching device. A lid unit for closing a container body of a thin-plate supporting container for use in storing semiconductor wafers therein is provided. A simplified attaching-and-detaching mechanism allows the lid unit to be attached and detached by easy locking and unlocking with respect to the container body. The simplified attaching-and-detaching mechanism includes a locking member engageable with a second receiving device of the container body, and a guiding member disposed at the extremity of the locking member, which guiding member reaches the second receiving device and guides the locking member into the second receiving device in a state in which the main body fits lightly in the container body. The guiding member includes a reaching portion that first reaches the second receiving device, and a guiding portion that guides the locking member to the second receiving device.

Lid attaching mechanism with camming unit for thin-plate supporting container

The present invention is directed to a lid unit having a latching mechanism for firmly fixing the lid unit to a container body for containing semiconductor wafers and the like, which latching mechanism can be easily disassembled for cleaning and drying of its components, and to a wafer presser for retaining the semiconductor wafers in position when the container is shaken. The latching mechanism includes a locking member which, when projected, secures the lid unit to the container body; an actuator for moving the locking member between projected and retracted positions; a tip-side cam for pressing a tip portion of the locking member in one direction relative to the lid unit when the locking member is projected by the actuator; a base-end lower cam for pressing a base-end of the locking member in a second direction, opposite the one direction; and a base-end upper cam and a cam projection follower for pressing the base-end in the second direction. The wafer presser is supported by a supporting projection bar formed with its ends thinner than its center portion.

Lid unit thin plate supporting container

The present invention provides a lid unit for closing the container bodythat is transported with thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanismsfor the production line are provided at the centers of the respective sides opposing with respect to each other. The simplified attaching/detaching mechanismfor the production line includes a locking platefor locking the second fitted portionand a drive-out memberfor allowing the drive-out memberto rise and set by being engaged with the locking plate. A locking armfor fixing the drive-out memberis provided on the drive-out memberat the end in the direction of rotation. A supporting railfor controlling the rising and setting movement of the locking plateis provided on the drive-out member. The locking plateis supported pivotally and slidably, and is provided with a holding clawfor engaging the second fitted portionat the distal end thereof. The thin-plate holding containeris used for transportation when the lid unitfor transportation is attached on the container body, and is used for the production line when the lid bodyfor the production line is attached thereon.

Lid unit for thin-plate holding container, thin-plate holding container, and simplified attaching/detaching mechanism

The invention provides a thin plate supporting container clamping device for fixing a thin plate supporting container when the thin plate supporting container in which semiconductor wafers are stored therein for transportation is placed on a loading port at a destination thereof for unloading and loading the semiconductor wafers automatically, including a hook member to be engaged with a retaining member of the thin plate supporting container; a drive unit for supporting the retracted thin plate supporting container in a state in which the hook member is supported so as to be capable of moving in the vertical direction and the hook member is engaged with the retaining member; and a control unit for adjusting a force to retract the hook member. The control unit adjusts the force to retract the hook member on the basis of detection values of a thickness sensor, a position sensor, and a retracting force detection sensor.

Thin plate supporting container clamping device

A single thin plate storage containerincludes a main bodyfor storing one thin wafer Ainside and a lid attached to the main body. The single thin plate storage containerincludes a bottom side support memberthat is located on the main bodyside and supports the lidfrom the bottom side, and a front side support memberthat is located on the lidside and supports the thin waferA from the upper front side. The bottom side support memberincludes a center support part, an outer periphery support part, a peripheral edge support part, and a ring platefor combining integrally the center support partand the outer support part. The front side support memberincludes a discfor covering the thin waferA from the upper side and abutting partsto sandwich the thin waferA between the two abutting parts and the bottom side support member

Single thin plate storage container and shock-absorbing support members used therein

A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Thin plate supporting container

Lid unit for thin plate supporting container

The attaching-and-detaching operation of a lid unit, and the operation of taking in and out semiconductor wafers stored in a container body are facilitated. Thin-plate supporting units for supporting semiconductor wafers are provided in the container body of a thin-plate supporting container, and wafer holding units for pressing and supporting the semiconductor wafers, supported by the thin-plate supporting units, from a lid unit side are provided inside a lid unit. The area of a lower surface of a V-shaped groove of the wafer holding unit is increased. The V-shaped groove easily fits the peripheral portion of the semiconductor wafer when attaching the lid unit to the container body. The lower surface of a V-shaped groove of the thin-plate supporting portion is roughened to enhance slipping property with respect to the semiconductor wafer. The angle of inclination of a ridge is determined to be 2 to 5 degrees with respect to the horizontal direction.

Thin-plate supporting container

The present invention provides a lid unit for closing a container body used to transport thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanisms are provided at the centers of the respective sides of the lid unit. The attaching/detaching mechanism includes a locking plate, for locking within a second recess, a lid receiving portion of the container body and a drive-out member for raising and locking the locking plate. A locking arm for fixing the drive-out member is provided on its leading side in the direction of engaging rotation. A supporting rail for guiding the raising and locking/unlocking movement of the locking plate is provided on the drive-out member. The locking plate is mounted for pivoting and sliding movement, and is provided with a holding claw for engagement within a second recess at the distal end thereof.

A wafer cassette comprises a case body and an adapter that supports substrates. There are adapters of various types corresponding to the size of the substrates to be supported. The case body and the adapter of any type are united in a manner such that fitting portions of the case body are fitted individually in fitting holes of the adapter.

Growing community of inventors

Shisui-machi, Japan

Tadahiro Obayashi