Seiko Instruments Inc

Atotech Deutschland Gmbh

Toray Advanced Film Co., Ltd.

Maruwa Corporation

Tadahiro Nishigawa

Tsutomu Matsuhira

Keiichiro Hayashi

Jun Higuchi

Hideaki Adachi

Nobukazu Koizumi

Hitoshi Ishikawa

In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, said insulator outer surface and said copper layer outer surface are simultaneously subjected to a process (1) comprising treatment with an alkali metal hydroxide solution, a process (2) comprising treatment with an alkaline aqueous solution containing an aliphatic amine, a process (3) comprising treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, a process (4) comprising treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and a process (5) comprising copper electroplating, which are implemented sequentially.

Method of forming a metal layer and method of manufacturing a substrate having such metal layer

In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80&#xb0; C. to 100&#xb0; C. Thereafter, an IC is mounted on the film substrate.

Method of manufacturing electric device

Growing community of inventors

Fukushima, Japan

Tadahiro Nishigawa