Nichia Corporation

Inphase Technologies, Inc.

Tadaaki Miyata

Yoshihiro Kimura

Naoki Mori

Motokazu Yamada

Yukitoshi Marutani

Hiroto Tamaki

Masatoshi Nakagaki

Hideki Kondo

Hideaki Takeda

Jason Ensher

Rodney Carl Harris

Masaki Omori

Hidenori Matsuo

Takahiro Oyu

A light source device includes a condensing lens, a laser light source, a first anti-reflection film, and a second anti-reflection film. The condensing lens has a curved surface. The laser light source includes a plurality of laser elements configured to emit laser beams incident on different regions of the curved surface of the condensing lens. The first anti-reflection film and the second anti-reflection film are disposed in different regions of the curved surface. The first anti-reflection film has a reflectance characteristic different from a reflectance characteristic of the second anti-reflection film.

Light source device, optical lens, and method of manufacturing optical lens

A light emitting device includes: laser diodes (LDs); a planar lightwave circuit (PLC) including optical waveguides; and a lens. The optical waveguides include: a first optical waveguide to receive first light emitted from a first LD and to emit the first light from a first light-exiting end; and a second optical waveguide to receive second light emitted from a second LD and to emit the second light from a second light-exiting end. The first light-exiting end causes refraction such that the first light exits in a first direction. The second light-exiting end causes refraction such that the second light exits in a second direction. A distance from the first light-exiting end to the lens along the first direction is shorter than a distance from the second light-exiting end to the lens along the second direction.

Light emitting device

A light source device includes: a substrate having a support face; a plurality of light emitting elements disposed on the support face, the plurality of light emitting elements including a first light emitting element and a second light emitting element, each of which is a vertical-cavity surface-emitting laser element; and a planar lightwave circuit having a light incident face that faces the support face and including a plurality of optical waveguides configured to guide light that has exited from the respective plurality of light emitting elements and entered the light incident face. The planar lightwave circuit is directly or indirectly supported by the plurality of light emitting elements. The substrate includes a first wiring layer electrically connected to the first light emitting element and the second light emitting element.

Light source device

A method for manufacturing a semiconductor device include: providing a submount that has a first surface, a second surface located on a side opposite the first surface, and at least one lateral surface located between the first surface and the second surface, the submount including: a groove located at the second surface, a heat dissipation portion located at the second surface, at least one end face through channel located at the at least one lateral surface, and an electrode pattern on the first surface; physically joining the heat dissipation portion to a package substrate by a first joint material; and after the step of physically joining the heat dissipation portion to the package substrate, disposing a second joint material inside the at least one end face through channel to electrically connect the electrode pattern and the package substrate.

Method for manufacturing semiconductor device with submount including groove on surface of submount having heat dissipation portion

A light source device includes: a laser diode configured to emit laser light; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode, the cap including: a first portion configured to transmit the laser light that is emitted from the laser diode, and a second portion that is bonded to the first portion. The second portion includes: a pair of lateral wall portions that are located at lateral sides of the laser diode, the pair of lateral wall portions being bonded to the first portion, a cover portion that is located above the laser diode and connects the pair of lateral wall portions together, and a rear wall portion that faces the first portion with the laser diode disposed between the first portion and the rear wall portion of the second portion.

Light source device and method of manufacturing the same

A light source deviceincludes a first substratehaving a first mounting surface, a second substratehaving a second mounting surfacethat opposes the first mounting surface, a first laser diodedirectly or indirectly supported by the first mounting surface, a second laser diodedirectly or indirectly supported by the first mounting surface, and a third laser diodedirectly or indirectly supported by the second mounting surface. The emission point of the third laser diode is positioned between the emission point of the first laser diode and the emission point of the second laser diode in the width direction, and in a plan view, when viewed in the direction perpendicular to the first mounting surface, at least one the first laser diode and the second laser diode at least partially overlaps the third laser diode.

Light source device including first substrate supporting first and second laser diodes and second substrate supporting third laser diode

A semiconductor device includes: a semiconductor element; a submount on which the semiconductor element is mounted, wherein the submount has a first surface on which the semiconductor element is mounted, a second surface located on a side opposite the first surface, and a lateral surface located between the first surface and the second surface, and wherein the submount comprises: a groove located at the second surface, a heat dissipation portion located at the second surface, and an electrode pattern located at the first surface; a package substrate on which the submount is mounted; a first joint member that physically joins the heat dissipation portion to the package substrate; and a connection portion located on the side surface, wherein the connection portion electrically connects the electrode pattern and the package substrate, and the connection portion comprises a second joint member.

Semiconductor device and method for manufacturing semiconductor device

A light source device includes: a laser light source configured to emit laser light having a peak wavelength included in a wavelength range of light absorbed or reflected by a first region or a second region of an object under study, the laser light source being configured to form a speckle pattern having speckle contrasts that differ between the first region and the second region; and a speckle variable device configured to control a coherence of the laser light in response to an external control signal.

Light source device and image-capturing device

A light source device includes: a laser diode including an emission end surface for emitting laser light and a rear end surface opposite to the emission end surface; a reflecting member that reflects a portion of the laser light emitted from the emission end surface of the laser diode; a photodetector configured to detect light that is reflected at the reflecting member; and a light-shielding member disposed between the rear end surface of the laser diode and the photodetector, the light-shielding member configured to shield at least a portion of light emitted from the rear end surface of the laser diode.

A light source device includes: a plurality of laser diodes that includes a first laser diode for emitting laser light of red color, a second laser diode for emitting laser light of green color, and a third laser diode for emitting laser light of blue color; a substrate directly or indirectly supporting the plurality of laser diodes; and a cap secured to the substrate and covering the plurality of laser diodes. The cap includes: a first glass portion configured to transmit the laser light that is emitted from the plurality of laser diodes, and a second glass portion. At least one of the first glass portion and the second glass portion comprises an alkaline glass region. The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region. The first glass portion is bonded to the substrate.

A light source device includes: first and second laser diodes; a reflector having: first and second reflecting faces configured to reflect a portion of light from the respective first and second laser diodes and to transmit a portion of the light from the respective first and second laser diodes, and first and second exit faces configured to allow the portions of the light transmitted through the respective first and second reflecting faces to exit; and a photodetector including: first and second light receiving element configured to receive light exiting the first and second exit faces, respectively. The reflector is configured such that the light transmitted through the first reflecting face is hindered from exiting the second exit face and the light transmitted through the second reflecting face is hindered from exiting the first exit face.

An image-capturing device includes: an illumination light source configured to emit illumination light to illuminate an object; a laser light source configured to emit laser light with a peak wavelength in a range of wavelengths absorbed or reflected by at least one region of the object; an imaging device configured to take an image of the object; a speckle variable device configured to change a speckle pattern in an image acquired by the imaging device over time; and an image processing device configured to process the image acquired by the imaging device, which includes: measuring a change over time in a intensity signal from each pixel constituting the image, and dividing an imaged region of the object into a plurality of portions based on a waveform of the change in the intensity signal over time.

Image-capturing device and image processing method

A light source device includes: a laser diode; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode. The cap includes a first glass portion configured to transmit laser light that is emitted from the laser diode, and a second glass portion. At least one of the first glass portion and the second glass portion includes an alkaline glass region. The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region.

A light source device includes at least one first wiring, a plurality of second wirings, a plurality of light emitting elements each having a lower-surface-side electrode connected to a respective one of the at least one first wiring, a plurality of protective elements each having a lower-surface-side electrode connected to a respective one of the plurality of second wirings each corresponding to a respective one of the plurality of light emitting elements, each of the plurality of protective elements connected to a respective one of the plurality of light emitting elements, a plurality of first wirings each connecting an upper-surface-side electrode of each of the plurality of light emitting elements and a respective one of the plurality of second wirings, a plurality of second wires each connecting the upper-surface-side electrodes of two adjacent ones of the protective elements; and a plurality of third wires each connecting an upper-surface-side electrode of a respective one of the plurality of protective elements and a corresponding one of the at least one first wiring. The upper-surface-side electrodes of the plurality of light emitting elements and the upper-surface-side electrodes of the plurality of protective elements are of a same polarity, and the plurality of first wires are disposed below the plurality of second wires.

A light source device includes: a laser diode configured to emit laser light; a substrate directly or indirectly supporting the laser diode; a glass cap secured to the substrate and covering the laser diode, the glass cap comprising a front glass wall configured to transmit the laser light that is emitted from the laser diode, the front glass wall having an incident surface on which the laser light is incident and an emission surface from which the laser light exits; and a photodetector directly or indirectly supported by the substrate and located outside of the glass cap. The photodetector is configured to detect light reflected at the front glass wall and is transmitted through the glass cap.

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Yokohama, Japan

Tadaaki Miyata