Nitto-denko Corporation

Tadaaki Harada

Toshitsugu Hosokawa

Yoshimasa Sakata

Katsumi Shimada

Yuuzou Akada

Satoshi Tanigawa

Sadahito Misumi

Takashi Taniguchi

Kazuhiro Ikemura

Hidetoshi Yoshitake

Kiichi Shimodaira

Tsutomu Nishioka

Toshiyuki Umehara

Nobuyoshi Yagi

Shinichi Ohizumi

Yasuhiko Yamamoto

Minoru Yamane

Syuuji Nishimori

Nobuyuki Hiromori

Yasumori Yoshimura

Katsuya Muramatsu

Hirokatsu Kouyama

Takahiko Maruhashi

Shinjirou Uenishi

Hideaki Taki

An optical resin sheet includes a cured resin layer containing glass fiber, wherein the ratio of the elastic modulus of the glass fiber to the elastic modulus of a cured resin material, which forms the cured resin layer, is 25 or more. With the thus arranged optical resin sheet, stress is applied to the glass fiber, thereby reducing the phenomenon of occurrence of birefringence, and when it is applied to a display device, there is achieved a significantly small light leakage in an oblique direction. The optical resin sheet is capable of achieving excellent display quality of an image display device such as a liquid crystal display device, as well as keeping the coefficient of thermal expansion lower and the mechanical strength higher.

Optical resin sheet and liquid crystal cell substrate including the same, liquid crystal display device, substrate for an image display device, and image display device

A resin sheet that is unlikely to be affected by heat and allows prevention of the occurrence of a crack is provided. A glass fiber cloth-like material is dipped into an epoxy resin solution and subjected to curing, thereby obtaining an epoxy resin-based sheet including the glass fiber cloth-like material. The resin sheet has a haze value of 10% or lower, and preferably, has a light transmittance of 88% or higher, an in-plane retardation of not more than 2 nm, a retardation in a thickness direction of 40 nm, and a surface roughness of not more than 2 &#x3bc;m.

Resin sheet, liquid crystal cell substrate comprising the same

The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability. The resin composition for semiconductor encapsulation comprises: (A) an epoxy resin; (B) a phenolic resin; (C) a latent curing accelerator; and D) an inorganic filler, and has a viscosity of 7,000 poise or more at 25&#xb0; C. and 5,000 poise or less at 80&#xb0; C.

Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device

Composition of epoxy resin, anhydride and microcapsule accelerator

Semiconductor sealing epoxy resin composition and semiconductor device using the same

Modified alkyl-terminated encapsulant for semiconductor of epoxy resin

A photosemiconductor device and an epoxy resin composition for use in molding a photosemiconductor used for the photosemiconductor device, the photosemiconductor device comprises a photosemiconductor element molded with a cured transparent epoxy resin composition, the cured transparent epoxy resin composition having a refractive index distribution curve characterized by the following (A), (B), and (C):

Photosemiconductor device and epoxy resin composition for use in molding

Growing community of inventors

Osaka, Japan

Tadaaki Harada