Taiwan Semiconductor Manufacturing Comp. Ltd.

Macronix International Co., Ltd.

Ta-Wei Lin

Kong-Beng Thei

Chien-Chih Chou

Yi-Huan Chen

Alexander Kalnitsky

Hsiao-Chin Tuan

Bao-Ru Young

Huan-Just Lin

Pei-Ren Jeng

Chih-Tang Peng

Jin-Aun Ng

Jen-Sheng Yang

Yuan-Tien Tu

Chih-Yang Yeh

Jung-Hui Kao

Hui-Wen Lin

Shih-Hao Lo

Maxi Chang

Harry-Hak-Lay Chuang

Wen-Jer Tsai

Fu-Jier Fan

Yi-Sheng Chen

Szu-Hsien Liu

Shi-Chuang Hsiao

Yu-Hong Kuo

Chia-Hong Wu

Kuo-Bin Huang

Chun-Hsiang Fan

Ming-Hsi Yeh

Tsung-Chieh Tsai

Chih-Pin Tsao

Hak-Lay Chuang

Tsu-Hui Su

Chia Ming Liang

Fu-Hsiung Yang

Chun-Liang Tai

Shih-Hsiang Chiu

Li-Hsuan Yeh

Ssu-Yu Liao

Yu-Lun Lu

Chieh-Chun Chiang

Ching-Hsun Hsu

Ting-Huan Hsieh

A semiconductor device includes a substrate, an interlayer dielectric layer, spacer structures, a gate insulating layer, a first work function metal layer and a metal gate. The interlayer dielectric layer is disposed above the substrate. The spacer structures are located in a trench of the interlayer dielectric. The gate insulating layer is disposed between inner sidewalls of the spacer structures. The gate insulating layer includes a first region doped with dipole dopant and second regions without the dipole dopant. The first region is connected with the second regions. The first region is horizontally located between the first work function metal layer and the spacer structures. The metal gate is disposed above the first work function metal layer. The metal gate is disposed between and in contact with the second regions.

Semiconductor device

Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. The method includes forming a stack of gate layers over a substrate. The stack of gate layers includes a first dielectric layer on the substrate, a conductive layer on the first dielectric layer, and a polysilicon layer on the conductive layer. A pair of source/drain regions is formed on opposing sides of a central region of the polysilicon layer. The central portion of the polysilicon layer is converted to a first silicide layer. The first silicide layer is spaced between inner sidewalls of the polysilicon layer.

FUSI gated device formation

Fin and nanostructured channel structure formation techniques for three-dimensional transistors can tune device performance. For example, fin profile control can be achieved by modifying the shape of fins/nanostructured channel structures so as to reduce their line edge roughness. Consequently, current flow within the channel regions of fins and nanostructured channel structures can be improved, enhancing device performance.

Fin shape modification

In some embodiments, the present disclosure relates to a semiconductor device comprising a source and drain region arranged within a substrate. A conductive gate is disposed over a doped region of the substrate. A gate dielectric layer is disposed between the source region and the drain region and separates the conductive gate from the doped region. A bottommost surface of the gate dielectric layer is below a topmost surface of the substrate. First and second sidewall spacers are arranged along first and second sides of the conductive gate, respectively. An inner portion of the first sidewall spacer and an inner portion of the second sidewall spacer respectively cover a first and second top surface of the gate dielectric layer. A drain extension region and a source extension region respectively separate the drain region and the source region from the gate dielectric layer.

Recessed gate for an MV device

A method of manufacturing a semiconductor device is provided. The method comprises the following steps of forming a first semiconductor layer over a substrate, the first semiconductor layer comprising a first semiconductor material; etching the first semiconductor layer to form a first recess; forming a second semiconductor layer in the first recess, the second semiconductor layer comprising a second semiconductor material different from the first semiconductor material; etching the first semiconductor layer and the second semiconductor layer to form a first fin comprising the second semiconductor layer and the first semiconductor layer; forming an insulation material over the substrate, wherein a top surface of the insulation material is flush with a top surface of the first fin; performing an implantation process on the first fin to form an implant region near the top surface of the first fin; and partially removing the insulation material to form shallow trench isolation regions, wherein the first fin is sandwiched by two adjacent shallow trench isolation regions.

Semiconductor device and manufacturing method thereof

Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes a gate electrode separated from a substrate by a gate dielectric. The gate electrode has one or more interior surfaces that form a recess within the gate electrode. A dielectric layer is disposed over the substrate and laterally surrounds the gate electrode. A dishing prevention structure is disposed within the recess. The dishing prevention structure is both vertically separated from the gate dielectric and laterally separated from the dielectric layer by the gate electrode. The dishing prevention structure continuously extends between outermost sidewalls of the dishing prevention structure as viewed along a cross-sectional view extending through a center of the recess.

Dishing prevention structure embedded in a gate electrode

Various embodiments of the present disclosure are directed towards an integrated chip including a gate dielectric structure over a substrate. A metal layer overlies the gate dielectric structure. A conductive layer overlies the metal layer. A polysilicon layer contacts opposing sides of the conductive layer. A bottom surface of the polysilicon layer is aligned with a bottom surface of the conductive layer. A dielectric layer overlies the polysilicon layer. The dielectric layer continuously extends from sidewalls of the polysilicon layer to an upper surface of the conductive layer.

A semiconductor structure is provided. The semiconductor structure includes a substrate, a diode region, and a dummy stripe. The substrate has a first surface. The diode region is in the substrate. The diode region includes a first implant region of a first conductivity type approximate to the first surface, and a second implant region of a second conductivity type approximate to the first surface and surrounded by the first implant region. The dummy stripe is on the first surface and located between the first implant region and the second implant region. A method for manufacturing a semiconductor structure is also provided.

Semiconductor structure and method for manufacturing thereof

In some embodiments, an integrated circuit is provided. The integrated circuit may include an inner ring-shaped isolation structure that is disposed in a semiconductor substrate. Further, the inner-ring shaped isolation structure may demarcate a device region. An inner ring-shaped well is disposed in the semiconductor substrate and surrounds the inner ring-shaped isolation structure. A plurality of dummy gates are arranged over the inner ring-shaped well. Moreover, the plurality of dummy gates are arranged within an interlayer dielectric layer.

Dishing prevention dummy structures for semiconductor devices

Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes a semiconductor substrate. A gate dielectric is disposed over the semiconductor substrate. A first source/drain region and a second source/drain region are disposed in the semiconductor substrate and on opposite sides of the gate dielectric. A gate electrode is disposed over the gate dielectric. A first dishing prevention structure is embedded in the gate electrode, where a perimeter of the first dishing prevention structure is disposed within a perimeter of the gate electrode.

Various embodiments of the present disclosure are directed towards a method for forming a fully silicided (FUSI) gated device, the method including: forming a masking layer onto a gate structure over a substrate, the gate structure comprising a polysilicon layer. Forming a first source region and a first drain region on opposing sides of the gate structure within the substrate, the gate structure is formed before the first source and drain regions. Performing a first removal process to remove a portion of the masking layer and expose an upper surface of the polysilicon layer. The first source and drain regions are formed before the first removal process. Forming a conductive layer directly contacting the upper surface of the polysilicon layer. The conductive layer is formed after the first removal process. Converting the conductive layer and polysilicon layer into a FUSI layer. The FUSI layer is thin and uniform in thickness.

A method forming a gate dielectric over a substrate, and forming a metal gate structure over the semiconductor substrate and the gate dielectric. The metal gate structure includes a first metal material. The method further includes forming a seal on sidewalls of the metal gate structure. The method further includes forming a dielectric film on the metal gate structure, the dielectric film including a first metal oxynitride comprising the first metal material and directly on the metal gate structure without extending over the seal formed on sidewalls of the metal gate structure.

Self-aligned insulated film for high-K metal gate device

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Minxiong, Taiwan

Ta-Wei Lin