E Ink Holdings Inc.

Ta-Nien Luan

Chi-Ming Wu

Ming-Sheng Chiang

Wen-Chang Lu

Yuan-Chih Tsai

Jen-Shiun Huang

Lee-Tyng Chen

Hung-Yi Tsai

Chen-Yuan Sung

You-Chi Tsai

Jen-Yi Juang

Chih-Cheng Wang

Shu-Ping Yan

Kuan-Lin Huang

Tsung-Chin Lin

Chen-Lung Lo

Chiang-Ling Tseng

Yen-Fong Liao

Chin-Hsuan Kuan

A method of manufacturing a flexible display device includes: forming an integrated circuit chip, a flexible printed circuit board and a frontplane laminate over a driving substrate; adhering a front protective layer over the frontplane laminate and the flexible printed circuit board, such that the front protective layer is in contact with the frontplane laminate, in which the front protective layer has a first opening corresponding to the integrated circuit chip; and filling a second adhesive into the first opening and covering an upper surface, a side surface or a combination thereof of the integrated circuit chip. A flexible display device is also provided.

Flexible display device and method of manufacturing the same

A flexible display apparatus includes a flexible display unit, a flexible film and a molding compound. The flexible display unit has a first region and a second region surrounding the first region, and the flexible film is disposed on the flexible display unit and at least located within the first region. The flexible film has a circumferential surface and at least one accommodating groove, the accommodating groove is sunken from the circumferential surface, and the flexible film exposes the second region of the flexible display unit. The molding compound is disposed on the flexible display unit, covers the circumferential surface and the second region exposed by the flexible film and fills the accommodating groove. A thickness of the molding compound filling the accommodating groove is the same as the thickness of the flexible film.

Flexible display apparatus

The invention provides a circuit substrate structure and a method for manufacturing thereof. The circuit substrate structure includes a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least one flattening material layer and a passivation layer. In the circuit substrate structure, the flattening material layer is positioned on the peripheral circuit layer, and possesses at least one opening corresponded to and around the integrated circuit chip. By positioning the flattening material layer, the circuit substrate structure possesses a flat surface, and prevents producing air bubbles, so as to enhance the reliability of the display device.

Circuit substrate structure and method for manufacturing thereof

A manufacturing method for a display module is provided. The method comprises following steps. A module structure comprising a cover plate, a substrate, and a front plate disposed between the cover plate and the substrate is provided. A space is defined by a lower surface of the cover plate, an upper surface of the substrate, and a side surface of the front plate. A holding structure comprising a holding layer disposed under the module structure is provided. A sealant is filled into the space. Portions of the package layer and the holding structure disposed outside a side surface of the cover plate and a side surface of the substrate are removed.

Manufacturing method for display module

A method for manufacturing an electronic ink display device is provided, which includes the steps of: forming an electronic ink layer on an driving substrate; forming a front protective layer and a back protective layer covering outside of the electronic ink layer and outside of the driving substrate separately, in which a dimension of the front protective layer is greater than that of the back protective layer; and filling an sealant covering and surrounding sidewall of the electronic ink layer and sidewall of the driving substrate. An electronic ink display device is also provided.

Electronic ink display device and method for manufacturing the same

A display device includes an active element array substrate, a display layer and a transparent shock absorption layer. The display layer is disposed on the active element array substrate. The transparent shock absorption layer is disposed on the display layer. The transparent shock absorption layer is formed by curing liquid adhesive material. A manufacturing method of display device is also provided.

Display device and manufacturing method thereof

A flexible display device includes a flexible substrate, a display layer, a first protecting layer, and at least one light-pervious polymer film. The display layer is arranged on the flexible substrate. The first protecting layer is arranged on the display layer. The at least one light-pervious polymer film is arranged on the first protecting layer. The light-pervious polymer film is used to protect the flexible display device from being damaged by external force.

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Hsinchu, Taiwan

Ta-Nien Luan