Stmicroelectronics S.a.

Sébastien Pruvost

Frédéric Gianesello

Jean-Francois Carpentier

Pierre Busson

Frederic Gianesello

Pierre Dautriche

Patrice Garcia

Christophe Loyez

Jocelyn Roux

Samuel Foulon

Nathalie Rolland

Frédéric Gianessello

A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

Integrated millimeter wave transceiver

A wireless data transmitter including: a data modulator adapted to modulate a data signal based on a frequency signal; and at least one antenna adapted to wirelessly transmit the modulated data signal and the frequency signal independently.

Wireless transmission system

A coplanar waveguide electronic device is formed on a substrate. The waveguide includes a signal ribbon and a ground plane. The signal ribbon is formed of two or more signal lines of a same level of metallization that are electrically connected together. The ground plane is formed of an electrically conducting material which includes rows of holes.

Coplanar waveguide

An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.

An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically coupled together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.

An electronic component for microwave transmission includes a high resistivity substrate on which is at least located several metallization layers divided into portions. A first set of piled up portions defines a ground ribbon and a second set of piled up portions defines a power ribbon. At least a first active portion of said ground ribbon and a first active portion of said power ribbon are respectively located between the substrate and an uppermost one of the several metallization layers. The electronic component in one implementation is a coplanar waveguide.

Semiconductor device

An integrated circuit includes many metallization levels. A thick dielectric region is placed above at least two metallization levels and laterally neighboring two or more metallization levels. That part of the two metallization levels which lie beneath the dielectric region forms a screen. A conducting strip is placed on the dielectric region so that the dielectric region forms a waveguide.

Growing community of inventors

Froges, France

Sébastien Pruvost