Taiwan Semiconductor Manufacturing Comp. Ltd.

Szu-Wei Tseng

Kuo-Chiang Tsai

Wei-Yang Lee

Chia-Pin Lin

Wei-Yuan Lu

Kuo-Yi Chao

Yuan-Ching Peng

Jiun-Ming Kuo

Tzu-Wei Kao

A method for forming a semiconductor device structure is provided. The method includes forming a dielectric layer over a substrate. The substrate has a base and a fin structure over the base, and the dielectric layer is over the base and surrounds the fin structure. The method includes forming a gate stack over the fin structure and the dielectric layer. The method includes removing portions of the dielectric layer, which are not covered by the gate stack. The method includes forming first spacers over first sidewalls of the gate stack. The method includes forming second spacers over second sidewalls of the fin structure. The method includes partially removing the fin structure, which is not covered by the gate stack and the first spacers. The method includes forming a source/drain structure over the fin structure, which is not covered by the gate stack and the first spacers.

Method for forming semiconductor device structure with second spacer over second sidewall of fin structure

Methods and semiconductor structures are provided. A method according to the present disclosure includes receiving a workpiece that includes a first gate structure disposed over a first active region, a second gate structure disposed over a second active region, a first gate spacer extending along a sidewall of the first gate structure and disposed at least partially over a top surface of the first active region, a second gate spacer extending along a sidewall of the second gate structure and disposed at least partially over a top surface of the second active region, and a source/drain feature. The method also includes treating a portion of the first gate spacer and a portion of the second gate spacer with a remote radical of hydrogen or oxygen, removing the treated portions, and after the removal, depositing a metal fill material over the source/drain feature.

Low resistance contact feature

The embodiments of the disclosure provide a FinFET. The FinFET includes a substrate, a first gate stack and a second gate stack. The substrate has a first fin and a second fin. The first gate stack is across the first fin and extends along a widthwise direction of the first fin. The second gate stack is across the second fin and extends along a widthwise direction of the second fin. A bottommost surface of the first gate stack is lower than a bottommost surface of the second gate stack, and a first gate height of the first gate stack directly on the first fin is substantially equal to a second gate height of the second gate stack directly on the second fin.

FinFET device and method of forming the same

First and second gates and first and second conductive contacts are disposed over a substrate. First and second vias are disposed over the first and second conductive contacts, respectively. A first gate contact is disposed over the first gate. A dielectric structure is disposed over the first gate and over the second gate. A first portion of the dielectric structure is disposed between the first and second vias. A second portion of the dielectric structure is disposed between the first via and the first gate contact. A first interface between the first conductive contact and the first via constitutes a first percentage of an upper surface area of the first conductive contact. A second interface between the first gate and the first gate contact constitutes a second percentage of an upper surface area of the first gate. The first percentage is greater than the second percentage.

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Hsinchu, Taiwan

Szu-Wei Tseng