Tronjen Medical Technology Inc.

Siliconware Precision Industries Co., Ltd.

Szu-Hsien Chen

Chiu-Fang Chen

Ya-Wen Ku

Ren-Shian Wang

Yu-Cheng Pai

Shu-Chi Chang

Hsien-Lung Hsiao

Hung-Kai Hsiao

Chia-Chi Lo

A pressure relief cushion includes an elastic layer which is made from a viscoelastic foam material, an adhesive carrying layer disposed on the elastic layer and including an adhesive portion and a carrier portion for carrying the adhesive portion, a hydrogel layer disposed on the adhesive carrying layer opposite to the elastic layer, and a detachable film disposed on the hydrogel layer opposite to the adhesive carrying layer.

Pressure relief cushion

Disclosed herein is a polyurethane foam sponge produced by the steps of a) providing an hydrophobic polyol which has six hydroxyl groups, b) providing a hydrophilic diisocyanate obtained by reacting a diisocyanate with a hydrophilic polyether diol, c) reacting the hydrophobic polyol with the hydrophilic diisocyanate to obtain a prepolymer which includes 3 to 6 isocyanate groups, and d) mixing the prepolymer with a hydrophilic polyether polyol, a blowing agent, an end-capping agent, a reinforcing agent, and a catalyst to obtain the polyurethane foam sponge. A wound dressing including the polyurethane foam sponge is also disclosed.

Polyurethane foam sponge and wound dressing having the same

Disclosed herein is a hydrogel wound dressing produced by the steps of a) providing an hydrophobic polyol which has six hydroxyl groups, b) providing an hydrophilic diisocyanate obtained by reacting a second diisocyanate with a hydrophilic polyether diol, c) reacting the hydrophobic polyol with the hydrophilic diisocyanate to obtain a first prepolymer which includes 3 to 6 isocyanate groups, d) partially crosslinking the first prepolymer using a crosslinking agent to obtain a second prepolymer, and e) subjecting the second prepolymer to an end-capping reaction with a silane-containing compound to obtain the hydrogel wound dressing.

Hydrogel wound dressing and method of preparing the same

A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.

Growing community of inventors

Taichung, Taiwan

Szu-Hsien Chen