Bayer Corporation

Cornell Research Foundation Inc.

Other

Bayer Aktiengesellschaft

Bayer Aktiengesellscaft

Sze-Ming Lee

Karen Marie Henderson

Douglas A Wicks

Jean M Frechet

Patricia B Jacobs

Lyubov K Gindin

Brian Long

Robert A Sylvester

Philip E Yeske

Robert J Kumpf

Carol L Kinney

Duane B Priddy, Jr

Eberhard Koenig

Harald Blum

Charles A Gambino

Jean M Fr Echet

Polyurethanes containing secondary amide groups and their use in one-component thermoset compositions

Aqueous polyurethane dispersions containing modified hydrazide groups and their use in one-component thermoset compositions

Aqueous polyurethane dispersions containing secondary amide groups and their use in one-component thermoset compositions

Aqueous polyurethane dispersions containing pendant amide groups and their use in one-component thermoset compositions

One-component thermoset coating compositions

The present invention relates to compounds containing modified hydrazide groups and corresponding to formula I ##STR1## wherein R represents the residue obtained by removing the isocyanate groups from a monomeric polyisocyanate, a polyisocyanate adduct or an NCO prepolymer,

The present invention relates to one-component, thermoset compositions containing

The present invention relates to heat-curable, cyclic isocyanate addition products

Heat-curable compositions based on cyclic isocyanate addition reproducts

Heat-curable compositions based on cyclic isocyanate addition products

A positive-tone photoresist is provided. The photoresist comprises a polymer, a photoactive agent, and a dissolution inhibitor. The dissolution inhibitor comprises a compound of Formula I: ##STR1## wherein R.sub.1 is a C.sub.1 -C.sub.20 alkyl, cyclo alkyl, benzyl, phenyl, alkyl substituted cyclo alkyl, alkoxy substituted cyclo alkyl, alkyl substituted phenyl, alkoxy substituted phenyl, acetoxy substituted phenyl, hydroxy substituted phenyl, t-butyloxycarbonyloxy substituted phenyl, diphenyl alkyl, alkyl substituted diphenyl, alkoxy substituted diphenyl, alkyl substituted diphenyl alkyl, or alkoxy substituted diphenyl alkyl; and R.sub.2 is a C.sub.1 -C.sub.20 alkyl, cyclo alkyl, benzyl, phenyl, alkyl substituted cyclo alkyl, alkoxy substituted cyclo alkyl, alkyl substituted phenyl, alkoxy substituted phenyl, hydroxy substituted phenyl, acetoxy substituted phenyl, or t-butyloxycarbonyloxy substituted phenyl. The present invention also provides a method of making microelectronic structures.

Positive-tone photoresist containing novel diester dissolution inhibitors

A photoresist is provided. The photoresist comprises a polymer, a photoactive agent, and a crosslinking agent. The crosslinking agent comprises a water soluble sugar. The present invention also provides a method of making microelectronic structures.

Photoresists containing water soluble sugar crosslinking agents

Method of making microelectronic structures utilzing photoresists

A positive-tone photoresist is provided. The photoresist comprises a polymer, a photoactive agent, and a dissolution inhibitor. The dissolution inhibitor comprises a compound of Formula I: ##STR1## wherein R.sub.1 is a C.sub.1 -C.sub.20 alkyl, cyclo alkyl, bensyl, phenyl, alkyl substituted cyclo alkyl, alkoxy substituted cyclo alky, alkyl substituted phenyl, alkoxy substituted phenyl, acetoxy substituted phenyl, hydroxy substituted phenyl, t-butyloxycarbonyloxy substituted phenyl, diphenyl alkyl, alkyl substituted diphenyl, alkoxy substituted diphenyl, alkyl substituted diphenyl alkyl, or alkoxy substituted diphenyl alkyl; and R.sub.2 is a C.sub.1 -C.sub.20 alkyl, cyclo alkyl, benzyl, phenyl, alkyl substituted cyclo alkyl, alkoxy substituted cyclo alkyl, alkyl substituted phenyl, alkoxy substituted phenyl, hydroxy substituted phenyl, acetoxy substituted phenyl, or t-butyloxycarbonyloxy substituted phenyl. The present invention also provides a method of making microelectronic structures.

Positive-tone photoresist containing diester dissolution inhibitors

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Pittsburgh, PA, United States of America

Sze-Ming Lee