Shinko Electric Industries Co., Ltd.

Nagano Prefecture

Shinshu University

Syuzo Aoki

Takuya Oda

Masao Nakazawa

Takuya Kurosawa

Kenji Kawamura

Yoriyuki Suwa

Shoji Koizumi

Hidekazu Takizawa

Yutaka Komatsu

Minshong Tan

Shinichi Anzawa

Sumio Uehara

Susumu Arai

Meisou Chin

An electronic component case includes, a lower case including a bottom plate, a side wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole formed in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.

Electronic component case and electronic component device

A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.

Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating component

In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method.

Composite plating liquid

An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.

A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal. The second plating layer is formed on the first plating layer to cover surfaces of the protruding parts and the surface of the second metal without filling spaces between the protruding parts.

Heat radiating component and method of producing same

A housing case housing an electronic circuit board, includes: a lower case portion which internally houses a circuit board for mounting electronic components; and an upper case portion which is externally fitted to the lower case portion to form a box-like member. Each of the lower case portion and the upper case portion includes a planar portion, and sidewall portions which stand from the peripheral edge of the planar portion. The planar portion and the sidewall portions are formed by using a plate-like member made of a metal material. Engaging projections which are outwardly projected are disposed on the sidewall portions of the lower case portion. Engaging holes which are passed through the sidewall portions of the upper case portion are disposed in the sidewall portions, in positions corresponding to the engaging projections of the lower case portion. The upper case portion is externally fitted to the lower case portion, and the engaging projections are engaged with the engaging holes, whereby the lower case portion and the upper case portion are fixed to each other.

Housing case for housing electronic circuit board, and electronic apparatus

In a semiconductor modulein which a semiconductor deviceis mounted on both surfaces of a circuit boardand heat radiation platesare provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation platesare fitted is formed in the circuit board, and a housing recess portionin which the semiconductor devicesare housed is provided to both heat radiation platesfitted to both surfaces of the circuit boardrespectively and a fitting edge portionis provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing meansfor fixing both heat radiation platesto the circuit boardby caulking to align with the fitting hole is provided to fitting edge portionsintegrally with the heat radiation plates

Growing community of inventors

Nagano, Japan

Syuzo Aoki