Hitachi, Ltd.

Renesas Technology Corp.

Other

Syuuji Eguchi

Hiroshi Kikuchi

Asao Nishimura

Kunihiko Nishi

Kunihiro Tsubosaki

Takashi Yokoyama

Gen Murakami

Makoto Kitano

Akihiro Yaguchi

Akio Hasebe

Takashi Yamazaki

Hiroshi Hozoji

Kazuyoshi Oshima

Masahiro Ichitani

Aizo Kaneda

Shozo Nakamura

Junichi Saeki

Isamu Yoshida

Sueo Kawai

Noriyuki Kinjo

Hiroyoshi Kokaku

Masatsugu Ogata

Masanori Segawa

Ichiro Anjo

Tetsuro Matsumoto

Ichiro Anjoh

Tetsurou Matsumoto

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the 'Lead-On-Chip' or 'Chip-On-Lead' structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Semiconductor device

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the &ldquo;Lead-On-Chip&rdquo; or &ldquo;Chip-On-Lead&rdquo; structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Semiconductor device including a resin sealing member which exposes the

Semiconductor device having all outer leads extending from one side of a

Semiconductor device chip on lead and lead on chip manufacturing

Growing community of inventors

Hitachi, Japan

Syuuji Eguchi