Daishinku Corporation

Daishinku Corproation

Syunsuke Satoh

Naoki Kohda

Hiroki Yoshioka

Tomo Fujii

Takashi Shirai

Shinichi Koyama

Hozumi Nakata

Minoru Iizuka

Yoshinobu Sakamoto

Yoshinari Morimoto

Tatsuya Murakami

Hiroyuki Ishihara

Masato Itoh

[Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.

Package member assembly, method for manufacturing the package member assembly, package member, and method for manufacturing piezoelectric resonator device using the package member

A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled waferintegrally formed with multiple lower lid members; a bonding step of bonding crystal resonator platesto one main surfaceof the wafervia a bonding materialand bonding upper lid memberson the crystal resonator plates via a bonding material; a thinning step of thinning the waferfrom the other main surfaceof the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained.

Method for manufacturing piezoelectric resonator device

In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed.

Piezoelectric resonator plate and manufacturing method for piezoelectric resonator plate

A tuning-fork type piezoelectric resonator plate includes: at least a plurality of leg portions serving as vibrating portions; a bonding portion bonded to the outside, and a base portion from which the leg portions and the bonding portion protrude. The plurality of leg portions protrude from a first end face of the base portion and are provided side-by-side on the first end face. The bonding portion protrude from a second end face located opposite the first end face of the base portion at a position located opposite a center position of the plurality of leg portions in a width direction of the first end face of the base portion. And, at least a base end portion of the bonding portion is used as a bond region that is bonded to the outside.

Tuning-fork type piezoelectric resonator plate comprising leg portions and a bonding portion respectively provided on first and second end faces of a base portion

A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves. Also, the piezoelectric resonator plate is electrically and mechanically bonded with the support member via the piezoelectric resonator plate bonding member in an area of the piezoelectric resonator plate using ultrasonic waves.

Piezoelectric resonator plate, and piezoelectric resonator device

A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member.

Sealing member of piezoelectric resonator device and manufacturing method therefor

An electrode forming region for providing lead electrodes () is provided on a crystal resonator plate (). Opposed side surfaces () of a substrate () are formed and inclined in the same direction with respect to a front major surface (). Also, an adhesion reinforcing portion () for reinforcing adhesion to a conductive adhesive () is provided in the electrode forming region for the lead electrodes (). For example, the adhesion reinforcing portion () is a notch portion which is cut and formed in the opposed side surfaces (). Thereby, an adhesion strength of the crystal resonator plate () and the conductive adhesive () is increased.

Piezoelectric resonator plate and piezoelectric resonator device

In a state in which respective portions of a quartz wafer have been masked by a plurality of kinds of mask layers that have respectively different etching rates, the quartz wafer is subjected to an etching process. Since the etching operation is started earlier at a first portion which is masked by the mask layer having a high etching rate, the amount of etching is increased at the first portion. In contrast, the start of the etching operation is delayed at a second portion which is masked by the mask layer having a low etching rate, and the amount of etching is reduced at the second portion. Thus, it becomes possible to form the quartz wafer into a desired shape.

Etching method, etched product formed by the same, and piezoelectric vibration device, method for producing the same

A piezoelectric element of a tuning fork resonator comprises a base portion and a plurality of leg portions. Drive electrodes are formed on top and bottom major surfaces and both side surfaces of each leg portion. The drive electrodes have polarities different between on the top and bottom major surfaces and the both side surfaces. The drive electrodes on the side surfaces are connected to each other. Further, metal film for frequency adjustment is formed on a tip portion of each leg portion of the piezoelectric element. The frequency adjustment is performed by removing the metal film formed on at least one surface of side surfaces and a tip surface of the tip portion by beam irradiation.

Frequency regulating method for tuning fork type vibrator and tuning fork type vibrator frequency-regulated by the method

A tuning fork resonator includes a base portion and leg portions extending from the base portion. A groove portion is formed in a major surface of each leg portion. An in-groove electrode is formed in the groove portion. A side surface electrode is formed on a side surface of the leg portion. The in-groove electrode and the side surface electrode are connected via a base portion electrode formed in the base portion. An outward extending groove electrode extending on a vertical wall facing the base portion and a leg portion tip-side major surface from the in-groove electrode of the groove portion, and a beside-groove electrode for leading the outward extending groove electrode on the leg portion major surface along beside the groove portion to the base portion electrode, are formed.

Growing community of inventors

Kakogawa, Japan

Syunsuke Satoh