C.uyemura Co., Ltd.

Syunsaku Hoshi

Masayuki Utsumi

Hisamitsu Yamamoto

Junji Mizumoto

Teruyuki Hotta

Takahiro Ishizaki

Takuya Okamachi

Fujio Asa

A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrateis sandwiched and held by a clipof a hanger. A pipeas a treatment solution releasing section is provided on each side of the substratethat is held by the hanger. This pipeis provided with a holefrom which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate, reaches a lower portion thereof, is circulated by a pump, and is released from the pipeagain.

Surface treating apparatus

An tank such as an electroless copper plating tank, includes a liquid squirting parthaving a squirt portfor squirting the processing solution Q from the squirt porttoward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like workso that the processing solution Q runs down the plate-like work

Growing community of inventors

Osaka, Japan

Syunsaku Hoshi