Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Syunji Onobori

Shozo Minamitani

Kenichi Nishino

Naoto Hosotani

Koichi Morita

A heating and pressurizing apparatus (), to which a circuit board () with electronic components () pre-bonded thereto via bonding elements () is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member () having a heating device (). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

A heating and pressurizing apparatus ( ), to which a circuit board ( ) with electronic components ( ) pre-bonded thereto via bonding elements ( ) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member ( ) having a heating device ( ). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Growing community of inventors

Kyoto, Japan

Syunji Onobori