Nichiban Company Limited

Syuji Ichimura

Kinnosuke Hino

Yoshinaga Tsuzuki

Yasuaki Kitazaki

Kazuhiro Kono

Masataka Sudo

Mikihiro Endo

Yusuke Sugiyama

Mikihiro Endou

Tomohisa Kato

A method for manufacturing adhesive resin pellets includes adding an antiblocking agent to water, melting an adhesive resin and extruding the adhesive resin into the water, and cutting the adhesive resin extruded into the water to form adhesive resin pellets. Polyolefin fine particles used for the antiblocking agent have an average particle diameter of 1 &#x3bc;m or more and less than 18 &#x3bc;m, and the adhesive resin has an adhesive force of less than 15.00 N/25 mm.

Adhesive resin pellets and method of manufacturing same

A chip-resistant film includes a composite substrate having an ionomer layer and a polyolefin-based polymer layer, with a strength at upper yield point of 10 to 40 N/10 mm, wherein a pressure-sensitive adhesive, which may be an acrylic pressure-sensitive adhesive, is placed over the polyolefin-based polymer layer. The chip-resistant film may also include an intermediate adhesive layer positioned between the ionomer layer and the polyolefin-based polymer layer. The chip resistance of an object to which the chip-resistant film has been applied is improved.

Chip-resistant film

An anti-chipping sheet includes at least a substrate layer and a pressure-sensitive adhesive layer, wherein the substrate layer comprises laminated multiple ionomer layers, each of which comprises an ionomer produced by neutralizing carboxyl groups of an ethylene-unsaturated carboxylic acid copolymer with metal ions, one of the multiple ionomer layers is a high-rigidity ionomer layer, located at the outermost layer and not in contact with the pressure-sensitive adhesive layer of the substrate layer, and having stiffness of 200 N/mmor higher, and another one of the multiple ionomer layers is a low-rigidity ionomer layer, located toward the pressure-sensitive adhesive layer in relation to the outermost layer, and having stiffness of lower than 200 N/mm.

Anti-chipping sheet

The present invention relates to a pressure-sensitive adhesive composition for a surface-protective film, the composition comprising 40% by weight or more of a hydrogenated random copolymer consisting of 1 to 50% by weight of styrene and 99 to 50% by weight of a diene hydrocarbon and 60% by weight or less of a tackifier resin and/or a softener, and when the pressure-sensitive adhesive composition of the present invention is applied to the surface-protective film, the composition is caused to exhibit excellent adhesion to adherends, not to leave stains of the adherends, nor to leaves traces thereon when the films are removed from the adherends, and can also impart excellent removability to surface-protective films.

Pressure-sensitive adhesive compositions for surface-protecting films

The pressure-sensitive adhesive sheet for surface protection has a three-layered film formed by laminating a layer A, a layer B and a layer C in this order and a pressure-sensitive adhesive layer formed on the layer C; wherein the layer A contains a polyethylene in an amount of at least 60% by weight based on a total weight of the layer A; the layer B contains a polypropylene type polymer in an amount of at least 50% by weight of based on a total weight of the layer B; and the layer C contains a hydrogenated styrene/diene type hydrocarbon copolymer in an amount of at least 10% by weight based on the total weight of the layer C. This sheet has excellent weathering resistance to undergo neither chalking nor fracture in the substrate at peeling, even after a prolonged outdoor exposure, develops less corona odor to enable extended operation of applying it, and can be manufactured inexpensively with reduced manufacturing process, since no anchor coat treating procedure is required.

Surface-protective pressure-sensitive adhesive sheet

The present invention is to provide a pressure-sensitive adhesive sheet for surface protection, which has a substrate containing an ethylene/propylene copolymer and an ethylene/1-butene copolymer in a weight ratio of 60:40 to 90:10, and an adhesive composition for pressure-sensitive adhesive sheets for surface protection, which contains 5 to 30 parts by weight of a rosin resin tackifier based on 100 parts by weight of a blend comprising 50 to 100% by weight of a polyisobutylene and/or a butyl rubber and 50 to 0% by weight of a polybutene.

Surface-protective pressure-sensitive adhesive sheet and pressure-sensitive adhesive composition for surface-protective pressure-sensitive adhesive sheet

Pressure-sensitive adhesive sheet for surface protection

Disclosed is a surface protective film which comprises:

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Tokyo, Japan

Syuji Ichimura