Tdk Corporation

Syuichiro Yamamoto

Masashi Gotoh

Jitsuo Kanazawa

Kenji Honda

A water treatment apparatus including a mixing bath having an open portion where a carbonic acid gas intermixed with water to be treated by the water treatment apparatus and dissolved oxygen excluded from the water to be treated are discharged. The water treatment apparatus also includes water storage tank separate from the mixing bath and in which treated water from the mixing bath is stored.

Production method of electronic parts and water treatment apparatus

A circuit board for mounting a part having a plurality of bumps by ultrasonic bonding. The circuit board includes a main body and a conductive layer provided on the main body. The conductive layer has a conductive pattern having at least one bonding area configured to correspond to the plurality of bumps of the part. The conductive layer has an isolated notch part located proximate the at least one bonding area.

Circuit board having bonding areas to be joined with bumps by ultrasonic bonding

An electronic part in which a chip,having bump electrodes is sealed in a cavity,of a resin container,, wherein the resin container having: a mounting board,having a conductor pattern,for bump-mounting the chip,; an intermediate board,overlaid on the mounting board,and having a window for forming an inner wall apart from the chip,for predetermined distances; a cover board overlaid on the intermediate board,to cover the window; a first adhesive layer,which is interposed between overlaid portions of the mounting board,and the intermediate board,; and a second adhesive layer,which is interposed between overlaid portion of the intermediate board,and the cover board,, wherein the first and second adhesive layers,and,between which the intermediate board,is interposed are heated and pressed at a time in a direction of the thickness of each of the mounting board,and the cover board,, and the mounting board,, the intermediate board,and the cover board,are brought into intimate contact with one another so as to seal and form the cavity,defined by the inner wall of the window.

Electronic part and manufacturing method therefor

A resin package fabrication processes comprises three steps. At the first step, a thermosetting resin-containing resin substrate is machined. At the second step carried out after the first step, the resin substrate is heated to an original glass transition temperature that the resin substrate has or a temperature that is higher than the glass transition temperature so that the glass transition temperature that the resin substrate has is elevated to a new glass transition temperature. At the third step, a resin layer is placed on at least a portion of the resin substrate to which the new glass transition temperature is imparted, and the resin substrate with the resin layer placed on that portion is then heated to the original glass transition temperature or a temperature between the original glass transition temperature and the new glass transition temperature, thereby fixing the resin layer to the resin substrate.

Resin package fabrication process

A through hole,formed in a substrate and having an electrode film on an inner surface thereof is cut and divided into two through holes or blind holes each of substantially semicircular arc shape through dicing processing using a rotating blade, and one of the-divided through holes,of substantially semicircular arc shape is used as an external connection terminal,of substantially semicircular concave arc shape thereby to form a surface mounted electronic parts having a plurality of the external connection terminals,. The height H of the substantially semicircular arc formed at an inner surface of each of the external connection terminals is set to be equal to or smaller than a value obtained by subtracting twice a thickness t of the electrode film from a radius R of a curvature of the arc.

Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by same

A wiring board having a conductor layer formed on a substrate and a connecting pad disposed in a connecting pad disposition portion provided in part of the conductor layer surface, the conductor layer having a resin inflow prevention portion which is provided adjacently to the said connecting pad disposition portion and which has a surface roughness greater than the surface roughness of the said connecting pad disposition portion, the resin inflow prevention portion being capable of overcoming the problem of prior art that an adhesive resin (resin layer) of a prepreg or an adhesive flows out onto the upper surface of the pad, due to its softening under heat and its being pressurized for bonding when a structure member such as a cover layer is bonded to the wiring board, and forms a cured resin which extremely inhibits the bonding property of a chip element onto the pad.

Growing community of inventors

Chiba, Japan

Syuichiro Yamamoto