Tokyo Electron Limited

Jsr Corporation

Syuichi Tsukada

Takashi Amemiya

Shigekazu Komatsu

Toshihiro Yonezawa

A probe card installed in a probe device includes a supporting plate capable of supporting a contact body and a circuit board installed above a top surface of the supporting plate. A connection member is installed at a top surface of the circuit board and the supporting plate and the connection member are connected to each other by a connection body. Load control members are installed at a top surface of the connection member and capable of maintaining a contact load between the contact body and an object to be inspected at a constant level. Elastic members are installed at a peripheral portion of the connection member and capable of fixing a horizontal position of the supporting plate. An intermediate member is installed between the circuit board and the supporting plate and configured to elastically and electrically connect the circuit board and the supporting plate.

Structure of probe card for inspecting electrical characteristics of object to be inspected

The present invention stably maintains contact between probe pins and a wafer. Screws are provided at a plurality of positions in an outer circumferential portion of a printed circuit board. On a lower surface side of the outer circumferential portion of the printed circuit board, a retainer plate is provided, and a bottom end surface of each of the screws is held down with the retainer plate. Turning each of the screws in a state where the bottom end surface of the each of the screws is held down with the retainer plate causes the outer circumferential portion of the printed circuit board to be moved up and down. Adjusting a height of the outer circumferential portion of the printed circuit board by turning each of the screws located at the plurality of positions enables parallelism of the entire probe card with respect to the wafer to be adjusted.

Probing apparatus and method for adjusting probing apparatus

Contact pressure between a wafer and a probe is maintained at an appropriate level. A probe cardhas a contactorfor supporting a probe, a printed wiring boardelectrically connected to the contactor, and a reinforcement member. On the upper surface side of the probe cardis provided a top plateconnected to the reinforcement memberby a connection member. A grooveis formed in the upper surface of the top plate, and a strain gaugeis attached at the groove. When a wafer W and the probeare in contact with each other, an upward load acts on the probe cardby pressure caused by the contact, and the load causes strain in the top plate. The amount of the strain in the top plateis measured, and contact pressure between the wafer W and the probeis regulated and set based on the amount of the strain.

Probe device and method of regulating contact pressure between object to be inspected and probe

In the present invention, an inspection contact structure is attached to a lower surface side of a circuit board of a probe card. The inspection contact structure has a silicon substrate, and sheets attached to upper and lower surfaces of the silicon substrate. Each of the sheets is elastic and has conductive portions in a projecting shape. The silicon substrate is formed with current-carrying paths passing through the substrate in a vertical direction so that the conductive portions of the sheets and the current-carrying paths of the silicon substrate are in contact with each other. The upper and lower sheets are fixed to the silicon substrate, and the sheet on the upper surface is fixed to a circuit board.

Growing community of inventors

Yamanashi, Japan

Syuichi Tsukada