Ngk Insulators, Inc.

Syuhei Ishikawa

Takaharu Iwadachi

Kazuo Ikushima

A low cost electroconductive spring material excellent in electroconductivity and spring performance, has from 1.8 to 3.0% by weight of Ni, from 0.15 to 0.35% by weight of Be, from 0.2 to 1.2% by weight of Si and the balance being copper. This low cost electroconductive spring material can be used in electric devices. As preferred embodiments, the electroconductive spring material may further contain from 0.05 to 3.0% by weight in a total amount of at least one component selected from Sn, Al and Zn provided that each of Sn, Al and Zn does not exceed 1.5% by weight, or from 0.01 to 1.5% by weight in a total amount of at least one component selected from Co, Fe, Zr, Ti and Mg, provided that each of Co, Fe, Zr, Ti and Mg does not exceed 1.0% by weight. Moreover, the electroconductive spring material is subjected to a final solidification heat treatment at a temperature of 880.degree.-950.degree. C., a cold processing of not greater than 80%, and an aging treatment at a temperature of 380.degree.-530.degree. C. for not more than 2 hours.

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Handa, Japan

Syuhei Ishikawa