Mitsubishi Gas Chemical Company, Inc.

Syouichi Itoh

Kenichi Mori

Michio Yaginuma

Kazuyoshi Uera

Yoshitaka Ueno

Kohei Kamatani

Masataka Kudo

Naoki Oka

Emi Fukasawa

Provided is a method for producing a silane compound, which does not produce corrosive substances such as acids, does not use organic solvents and which contributes to a reduction in environmental load. This method for producing a silane compound has D) a siloxane decomposition step for heating a mixture containing: a siloxane compound A), which is a cyclic siloxane compound A-1) represented by formula (1), a linear siloxane compound A-2) represented by formula (2) and/or a silsesquioxane compound that is represented by formula (3) and has a siloxane bond as a main chain skeleton; a carbonate compound B) including at least one of a diaryl carbonate, a dialkyl carbonate and a monoalkylmonoaryl carbonate; and a basic compound catalyst C). The step D) further includes subjecting the siloxane compound A) to alkoxylation and/or aryloxylation. (In the formulae, Rto R, X, n, m and pare as described in the description of the present application.)

Method for producing silane compound

Provided are a resin composition having excellent electrical characteristics and heat resistance after moisture absorption, and being also excellent in flowing characteristics at the time of production of a laminate, and a prepreg, a metal foil-clad laminate and a resin sheet using the same. Used is a resin composition comprising a bifunctional phenylene ether oligomer (a) having a polyphenylene ether skeleton, an aralkyl-based cyanate ester compound (b), a bisphenol-based cyanate ester compound (c), an epoxy resin (d), a brominated carbonate oligomer (e), an inorganic filler (f), an alkoxynaphthol-based polymerization inhibitor (g) and/or a thioether-based polymerization inhibitor (h).

Resin composition, prepreg and metal foil-clad laminate

A resin composition has high flame retardancy and excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and single-layer or laminated sheet, a metal foil-clad laminate using the prepreg, and the like. The resin composition has polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. wherein m represents an integer of 1 to 3.

Resin composition, prepreg, resin sheet, and metal foil-clad laminate

A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

Growing community of inventors

Tokyo, Japan

Syouichi Itoh