L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des

L'air Liquide

Sylvie Mellul

Frederic Rotman

Dominique Navarro

Thierry Sindzingre

Eric L Duchateau

Pierre Claverie

Marc Leturmy

Michel Verlhac

Denis Fumat

In a method of dry process fluxing at least one surface of a metallic article, the surface to be fluxed is treated with a plasma at atmospheric pressure of a gaseous mixture comprising hydrogen and optionally at least one inert gas. The invention also concerns an apparatus, particularly for practicing the process, as well as a process for soldering or plating.

Method and apparatus for dry process fluxing

A solder composition is applied to the pins of an electronic component. The pins of the component are brought into contact with solder at a soldering station having a bath exposed to a controlled atmosphere of low oxygen content maintained in a hood enclosing at least the surface of the bath. The controlled atmosphere is comprised of at least one neutral gas and a gaseous silicon hydride whose content is between 50.times.10.sup.-6 and 2.times.10.sup.-3 of the volume of the controlled atmosphere. The controlled atmosphere is produced:

Process for the application of solder composition on the pins of

The invention relates to a process for preparing interconnection substrates of hybrid circuits, comprising effecting on a support the deposition of a thick layer of ink or paste based on a non-noble metal, such as copper or other material having a 'copper compatible' formulation, by carrying out in succession a preliminary drying for eliminating solvents at a temperature on the order of 100.degree. C. to 150.degree. C., a firing comprising:

Process for preparing electrical connection means, in particular

A device for providing a non-oxidizing atmosphere above a soldering bath in a vat of a machine for wave soldering, includes a hooding assembly closing the vat, an inner space and a conveyor for electronic circuits extending through the inner space. The inner space is separated from the surrounding atmosphere through seals disposed along the path of the circuits. There is structure for providing and maintaining a non-oxidizing atmosphere in the inner space, for example an inert gas or a mixture of inert and reducing gas.

Device for providing a non-oxidizing atmosphere above a soldering bath

The process comprises, after deposition of a layer of raw ink on a support having a high thermal dissipation, of the aluminium nitride type, effecting a preliminary drying of this ink at a temperature on the order of 100.degree. C. to 150.degree. C., then a firing comprising:

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Vitry-sur-Seine, France

Sylvie Mellul