International Business Machines Corporation

International Paper Company

Sylvia Adae-Amoakoh

Voya Rista Markovich

John M Lauffer

John Steven Kresge

Thurston Bryce Youngs, Jr

Michael D Lowell

Bruce M Resnick

Joseph J Sniezek

A method for forming a flip-chip joinable substrate having non-plated-on contact pads. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.

Economical high density chip carrier

A flip-chip joinable substrate having non-plated-on contact pads. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.

A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

Method of making a parallel capacitor laminate

Capacitor laminate for use in printed circuit board and as an interconnector

Photographic developing compositions are provided that are free of dihydroxybenzene developing agents and are used in the processing of photographic elements. The developing compositions have a pH in the range of from 10.1 to 10.9 and comprise at least 0.17 moles per liter of an ascorbic acid developing agent, 0.3 to 0.5 moles per liter of a sulfite and 0.2 to 0.4 moles per liter of a carbonate buffer. Also provided is an ecologically advantageous method for processing photographic elements which utilizes the non-toxic developing compositions.

Growing community of inventors

Binghamton, NY, United States of America

Sylvia Adae-Amoakoh