Texas Instruments Corporation

Sylvester Tigno Sanchez

Rafael Jose Lizares Guevara

Ray Fredric Solis De Asis

Alvin Lopez Andaya

Aniceto Tabangcura Rabilas, Jr

Dolores Babaran Milo

Ruby Ann Merto Camenforte

Richard Diestro Sumalinog

In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.

Textured bond pads

A method of manufacturing a semiconductor package includes attaching semiconductor dies to an array of leadframes and positioning a clip array in alignment with the array of leadframes within a mold cavity, the clip array including clips that electrically connect to at least some of the semiconductor dies and a siderail along a perimeter of the clip array. The siderail forms a set of reliefs extending from an outer edge of the siderail to an inner edge of the siderail, the inner edge being adjacent to the array of leadframes. The method also includes injecting a mold compound into the mold cavity through a flow path including the set of reliefs of the siderail to form a mold block at least partially covering the semiconductor dies.

Siderail with mold compound relief

Growing community of inventors

Manila, Philippines

Sylvester Tigno Sanchez