Ismeca Semiconductor Holding Sa

Ismeca Semiconductor Holdings Sa

Sylvain Vienot

Philippe Roy

Massimo Scarpella

Franco Craveiro

Valerio Osler

Phillipe Viverge

Philippe Viverge

A feeding assembly and a method of feeding components comprising a track along which components can be moved, said track comprising a sloped surface and a ledge, wherein said sloped surface slopes in a direction perpendicular to the direction which the components move along the track so that the components maintain a tilted orientation as they move along the track, a pickup platform comprising a pocket which can receive components from said track, and a pivot on which the pickup platform can be selectively rotated between a first position and second position. In the first position, the pocket is aligned with the track and the pocket is parallel with the sloped surface of the track, so that a component can move from the track into the pocket of the pickup platform. In the second position the pocket is in a horizontal orientation.

Feeding assembly, component handling assembly and method of feeding components

A nest includes a fix part, and a movable part, wherein the fix part and movable part are configured to cooperate so as to define a pocket which can receive at least a part of an electrical component, wherein the movable part is moveable between a first position and a second position, wherein in the first position the pocket is open so that at least part of the electrical component can be moved into the pocket, and in the second position the pocket is closed so that the at least part of the electrical component positioned in the pocket is secured within the pocket, wherein the nest further includes a biasing means which is arranged to bias the movable part towards its second position. There is further provided a nest assembly, a component handling assembly, and a table that includes the nest.

Electrical component testing nest

A method for filling a carrier tape () with electronic components () and for removing and replacing defective electronic components () from the carrier tape, comprising the steps of:

Method and device for filling carrier tapes with electronic components

Growing community of inventors

Villers-le-Lac, France

Sylvain Vienot