Industrial Technology Research Institute

Syh-Ming Ho

Jing-Pin Pan

Tsung-Hsiung Wang

Tsung H Wang

Han L Chen

Tzong-Ming Lee

Ker-Ming Chen

Chien-Hui Li

Shing-Yaw Hsu

Richard P Cheng

Aina Hung

It is disclosed a process for producing an easily removable polyimide film comprising the steps of:

Process for producing easily removable polyimide resin film

A polyimide/copper foil laminate prepared using a polyimide composition that does not require an adhesive layer between the polyimide substrate and the copper foil. A polyimide precursor is first prepared from a monomer composition, which comprises a dianhydride and an imidazole-containing or benzimidazole-containing compound, or mixture thereof. The polyimide precursor is then coated onto a copper foil and subsequently subject to an imidization reaction to form a polyimide/copper foil laminate, which exhibits excellent peel strength and flatness while retaining all the advantageous properties that are characteristic of polyimide resins, such as excellent mechanical strength and heat and chemical resistance. Because the polyimide/copper foil laminates disclosed in the present invention are made without the need to apply an ahsesive layer, the process of manufacturing the same is greatly simplified and the cost of production therefor can be substantially reduced. Furthermore, many of the problems caused by the inferior chemical and/or physical properties of the adhesive layer are completely eliminated.

Polyimide composition for polyimide/copper foil laminate

A polyimide composition for use in making polyimide/copper foil laminate that does not require an adhesive layer between the polyimide substrate and the copper foil. A polyimide precursor is first prepared from a monomer composition, which comprises a dianhydride and an imidazole-containing or benzimidazole-containing compound, or mixture thereof The polyimide precursor is then coated onto a copper foil and subsequently subject to an imidization reaction to form a polyimide/copper foil laminate, which exhibits excellent peel strength and flatness while retaining all the advantageous properties that are characteristic of polyimide resins, such as excellent mechanical strength and heat and chemical resistance. Because the polyimide/copper foil laminates disclosed in the present invention are made without the need to apply an adhesive layer, the process of manufacturing the same is greatly simplified and the cost of production therefor can be substantially reduced. Furthermore, many of the problems caused by the inferior chemical and/or physical properties of the adhesive layer are completely eliminated.

A heat resistant adhesive composition comprising an admixture of a modified bismaleimide (BMI) resin, a modified polyamide-imide and a solvent. The bismaleimide is modified by barbituric acid and/or the derivatives thereof and the polyamide-imide is modified by an epoxy resin. The overall solid content of the heat resistant adhesive composition is in the range of about 15 to 50 percent by weight, wherein solid contents per overall solid content of the modified bismaleimide resin and the modified polyamide-imide are 60 to 90 percent and 10 to 40 percent, respectively.

Heat resistant modified bismaleimide adhesive composition

Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismaleimide and its derivatives on the surface of the metal sheet. The resulting metal sheet is particularly adapted for being bonded to a polyimide film for the preparation of, for example, a printed circuit board. Also disclosed is a method of bonding the metal sheet of the present invention to a polyimide substrate. Precursor of polyimide are coated on the surface of the plate metal sheet and then thermal imidizing of the precursors takes place. No additional adhesives are needed for this bonding.

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Hsinchu, Taiwan

Syh-Ming Ho