Nanonexus Corporation

Agency for Science, Technology and Research

Institute of Materials Research and Engineering

Syamal Kumar Lahiri

Fu Chiung Chong

Sammy Mok

Frank Swiatowiec

Joseph Michael Haemer

Dongzhi Chi

Chang-Ming Lin

Erh-Kong Chieh

Roman Milter

David Doan

Dominique Mangelinck

Yi-Hsing Chen

Rinus Tek Po Lee

Zuruzi Bin Abu Samah

A method of fabricating a gate electrode for a semiconductor comprising the steps of: providing a substrate; providing on the substrate a layer of a first material of thickness t, the first material being selected from the group consisting of Si, Si&#x2014;Gealloy, Ge and mixtures thereof and a layer of metal of thickness t; and annealing the layers, such that substantially all of the first material and the metal are consumed during reaction with one another.

Gate electrodes and the formation thereof

This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

Miniaturized contact spring

A method of constructing an electrical contact on an electronic component comprises first forming a protruding electrically conducting stud at a contact location by wire bonding a metal wire to a contact pad of the component. The stud is then contacted with solder, without using a mask, so that a solder bump is deposited on and adheres to the metal stud to form a composite solder contact which is able to form with a contact of another component a solder joint which has good electrical and mechanical properties and which may be reliable fabricated at high density by a low cost method. An electronic component provided with such solder contacts and an electronics component package including such a component are also disclosed.

Forming an electrical contact on an electronic component

Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a compliant carrier structure, such as a decal or screen, which is adhesively attached to the probe chip substrate.

Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs

A method of fabricating a silicide layer on a silicon region of a semiconductor structure, the method comprising the steps of: providing a semiconductor structure having at least one silicon region on a surface thereof; depositing a layer comprising nickel and platinum on the at least one silicon layer; annealing the semiconductor structure and the nickel/platinum layer to react the nickel and the platinum with underlying silicon to form a nickel-platinum silicide, wherein annealing step takes place at temperature of between 680&deg; C. and 720&deg; C.

Method of fabricating a nickel/platinum monsilicide film

Growing community of inventors

Milpitas, CA, United States of America

Syamal Kumar Lahiri