Intel Corporation

Syadwad Jain

Zhizhong Tang

Wei Hu

James Chris Matayabas, Jr

Hemanth K Dhavaleswarapu

Nachiket R Raravikar

Rajen S Sidhu

John J Beatty

Aravindha Antoniswamy

Randall D Lowe, Jr

Dinesh P R Thanu

Carl L Deppisch

Thomas John Fitzgerald

Manish Dubey

Kelly P Lofgreen

Paul R Start

Patrick Nardi

Michael Aaron Schroeder

Kumaran Murugesan Chakravarthy

Boxi Liu

A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.

Heat spreader edge standoffs for managing bondline thickness in microelectronic packages

Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.

Heat spreaders with interlocked inserts

Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.

Integrated heat spreader having electromagnetically-formed features

Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

Foam composite

A multiple chip package is described with multiple thermal interface materials. In one example, a package has a substrate, a first semiconductor die coupled to the substrate, a second semiconductor die coupled to the substrate, a heat spreader coupled to the die, wherein the first die has a first distance to the heat spreader and the second die has a second distance to the heat spreader, a first filled thermal interface material (TIM) between the first die and the heat spreader to mechanically and thermally couple the heat spreader to the die, and a second filled TIM between the second die and the heat spreader to mechanically and thermally couple the heat spreader to the second die.

Multiple-chip package with multiple thermal interface materials

A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example.

Polymer thermal interface material having enhanced thermal conductivity

Embodiments of the present disclosure describe techniques and configurations for paste thermal interface materials (TIMs) and their use in integrated circuit (IC) packages. In some embodiments, an IC package includes an IC component, a heat spreader, and a paste TIM disposed between the die and the heat spreader. The paste TIM may include particles of a metal material distributed through a matrix material, and may have a bond line thickness, after curing, of between approximately 20 microns and approximately 100 microns. Other embodiments may be described and/or claimed.

Paste thermal interface materials

Embodiments of the present disclosure describe techniques and configurations for molded heat spreaders. In some embodiments, a heat spreader includes a first insert having a first face and a first side, the first face positioned to form a bottom surface of a first cavity, and a second insert having a second face and a second side, the second face positioned to form a bottom surface of a second cavity. The second cavity may have a depth that is different from a depth of the first cavity. The heat spreader may further include a molding material disposed between the first and second inserts and coupled with the first side and the second side, the molding material forming at least a portion of a side wall of the first cavity and at least a portion of a side wall of the second cavity. Other embodiments may be described and/or claimed.

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Chandler, AZ, United States of America

Syadwad Jain