Applied Materials, Inc.

Sy-Yuan Brian Shieh

Ashok K Sinha

Gerardo Delgadino

Indrajit Lahiri

Teh-Tien Su

A substrate is processed in a process chamber comprising a substrate support having a receiving surface for receiving a substrate so that a front surface of the substrate is exposed within the chamber. An energized process gas is used to process the front surface of the substrate. A peripheral edge of the backside surface of the substrate is cleaned by raising the substrate above the receiving surface of the substrate support to a raised position, and exposing the backside surface of the substrate to an energized cleaning gas.

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Palo Alto, CA, United States of America

Sy-Yuan Brian Shieh