Semiconductor Components Industries, LLC

Swee Har Khor

Chee Hiong Chew

Yusheng Lin

Erik Nino Tolentino

Phillip Celaya

Hui Min Ler

Tian Hing Lim

Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.

Reinforced semiconductor die and related methods

In one embodiment, methods for making semiconductor devices are disclosed.

Semiconductor devices and methods of making the same

Growing community of inventors

Kuala Lumpur, Malaysia

Swee Har Khor