Candescent Technologies Corporation

Candescent Intellectual Property Services, Inc.

Canon Kabushiki Kaisha

Swayambu Ramani

Kishore K Chakvorty

Duane A Haven

Christopher J Spindt

N Johan Knall

Kishore K Chakravorty

Stephanie Jeanne Oberg

Arthur J Learn

Roger W Barton

Ronald S Besser

Johan Knall

Paul J Louris

Johan N Knall

A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a cathodic structure which is formed within an active area on a backplate. The cathodic structure includes a emitter electrode metal composed of strips of aluminum overlain by a layer of cladding material. The use of aluminum and cladding material to form emitter electrode metal gives emitter electrode metal segments which are highly conductive due to the high conductivity of aluminum. By using a suitable cladding material and processing steps, a bond between the aluminum and the cladding material is formed which has good electrical conductivity. In one embodiment, tantalum is used as a cladding material. Tantalum forms a bond with the overlying resistive layer which has good electrical conductivity. Thus, the resulting structure has very high electrical conductivity through the aluminum layer and high conductivity into the resistive layer. Electrode structures that use resistor material, chromium-containing material, nickel and vanadium alloy, and gold are also disclosed.

Dual-layer metal for flat panel display

A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a cathodic structure which is formed within an active area on a backplate. The cathodic structure includes a row metal composed of strips of aluminum overlain by a layer of cladding material. The use of aluminum and cladding material to form row metal gives row metal segments which are highly conductive due to the high conductivity of aluminum. By using a suitable cladding material and processing steps, a bond between the aluminum and the cladding material is formed which has good electrical conductivity. In one embodiment, tantalum is used as a cladding material. Tantalum forms a bond with the overlying resistive layer which has good electrical conductivity. Thus, the resulting structure has very high electrical conductivity through the aluminum layer and high conductivity into the resistive layer.

A thin-film coupled to a substrate includes a first layer and a second layer. Both layers are made of the same material, which is either a transition or a refractory metal. The first layer is doped by nitrogen and the second layer is not. The thin-film has lower stress level than a film made of the same material and having similar thickness as the thin-film, but without doping the film by nitrogen. Also, the thin-film has a lower sheet resistance than a film made of the same material, having similar thickness as the thin-film, and with similar atom percentage of nitrogen as the first layer. In one embodiment, the thin-film is used in a flat panel display.

Low-stress and low-sensitivity metal film

An electron-emitting device employs a multi-layer resistor (46). A lower layer (48) of the resistor overlies an emitter electrode (42). A set of electron-emissive elements (54) overlie an upper layer (50) of the resistor. Each resistive layer extends continuously from a location below each electron-emissive element to a location below each other electron-emissive element. The two resistive layers are of different chemical composition. The upper resistive layer is typically formed with cermet. The lower resistive layer is typically formed with a silicon-carbon compound.

Electron-emitting device having multi-layer resistor

Growing community of inventors

San Jose, CA, United States of America

Swayambu Ramani