Hewlett-packard Development Company, L.p.

Swaroop K Kommera

Siddhartha Bhowmik

David M Braun

Richard J Oram

Manish Giri

Sriram Ramamoorthi

Robert N K Browning

Tim R Koch

Joshua W Smith

Charles Gustav Schmidt

Christopher C Aschoff

Phillip G Rourke

Philip G Rourke

Robert NK Browning

A print head die () includes slot ribs () having edges () with triangular notches. In one embodiment, the print head die is formed by dry etching from a first side () of a wafer () a series of spaced openings () completely through the wafer () and separated by ribs () followed by wet etching the wafer () from a second opposite side () to recess the ribs () from the second side ().

Print head slot ribs

Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.

Print head die slot ribs

A slot is formed that reaches through a first side of a silicon substrate to a second side of the silicon substrate. A trench is laser patterned. The trench has a mouth at the first side of the silicon substrate. The trench does not reach the second side of the silicon substrate. The trench is dry etched until a depth of at least a portion of the trench is extended approximately to the second side of the silicon substrate (). A wet etch is performed to complete formation of the slot. The wet etch etches silicon from all surfaces of the trench.

Formation of a slot in a silicon substrate

A method of manufacturing an electromagnetic (EM) waveguide capable of guiding a wave along a pre-defined propagation path is described. The method includes providing a core region that extends along the propagation path and printing a colloidal crystal comprised of first particles on the waveguide core region.

Electromagnetic waveguide

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Corvallis, OR, United States of America

Swaroop K Kommera