Intel Corporation

Swadesh Choudhary

Debendra Das Sharma

Zuoguo Wu

Lakshmipriya Seshan

Narasimha Lanka

Gerald S Pasdast

Mahesh U Wagh

Bahaa Fahim

Yen-Cheng Liu

Narasimha R Lanka

Sridhar Muthrasanallur

Robert G Blankenship

Sailesh Kumar

Mahesh S Natu

Michelle C Jen

Vinit Mathew Abraham

Siva Prasad Gadey

Ankush Varma

Peter Onufryk

Vedaraman Geetha

Brinda Ganesh

Rahul Pal

Doddaballapur N Jayasimha

Nikhil Gupta

Jonas Svennebring

Tejpal Singh

Yogesh Bansal

Nitish Paliwal

Manjula Peddireddy

Peeyush Purohit

Ajit Krisshna Nandyal Lakshman

Lee Albion

Ujjwal Gupta

Nikethan Shivanand Baligar

Raghucharan Boddupalli

Monam Agarwal

Pradeep Prabhakaran

Embodiments described herein may include apparatus, systems, techniques, or processes that are directed to on-package die-to-die (D2D) interconnects. Specifically, embodiments herein may relate to on-package D2D interconnects for memory that use or relate to the Universal Chiplet Interconnect Express (UCIe) adapter or physical layer (PHY). Other embodiments are described and claimed.

On-package die-to-die (D2D) interconnect for memory using universal chiplet interconnect express (UCIe) PHY

A retimer includes a first port to couple to a die over a first interconnect, where the first interconnect includes a defined set of lanes and utilizes a first communication technology, and the die is located on a first package with the retimer. The retimer further includes a second port to couple to another retimer over a second interconnect, where the second interconnect utilizes a different second communication technology, and the second retimer is located on a different, second package to facilitate a longer reach communication channel.

Retimers to extend a die-to-die interconnect

In one embodiment, a first die comprises: a first die-to-die adapter to communicate with first protocol layer circuitry via a flit-aware die-to-die interface (FDI) and first physical layer circuitry via a raw die-to-die interface (RDI), where the first die-to-die adapter is to receive message information comprising first information of a first interconnect protocol; and the first physical layer circuitry coupled to the first die-to-die adapter. The first physical layer circuitry may be configured to receive and output the first information to a second die via an interconnect, the first physical layer circuitry comprising a plurality of modules, each of the plurality of modules comprising an analog front end having transmitter circuitry and receiver circuitry. Other embodiments are described and claimed.

Standard interfaces for die to die (D2D) interconnect stacks

Embodiments herein relate to a die of a multi-die package, wherein the die is coupled with another die via a die-to-die (D2D) interconnect link. The die may transmit a data signal to the other die via a data lane of the D2D interconnect link. The die may further transmit, concurrently with the data signal, a valid signal to the other die via a valid lane of the D2D interconnect link. The valid signal may change logical state at least once during the transmission of the data signal. Other embodiments may be described and claimed.

Valid signal for latency sensitive die-to-die (D2D) interconnects

In one embodiment, an apparatus includes: a transaction layer circuit to output transaction layer information; and a link layer circuit coupled to the transaction layer circuit, the link layer circuit to receive and process the transaction layer information and to output link layer information to a physical circuit. The link layer circuit may include a first selection circuit to receive and direct cache memory protocol traffic to a selected one of a first logical port and a second logical port. Other embodiments are described and claimed.

System, apparatus and method for handling multi-protocol traffic in data link layer circuitry

In one embodiment, an apparatus includes: a die-to-die adapter to communicate with a protocol layer and physical layer circuitry, and the physical layer circuitry coupled to the die-to-die adapter, where the physical layer circuitry is to receive and output first information to a second die via an interconnect. The physical layer circuitry, after a reset flow for the first die, is to: perform a sideband initialization of a sideband interface of the interconnect to detect that the second die has completed a reset flow for the second die; and after the sideband initialization, perform a mainband initialization of a mainband interface of the interconnect at a lowest speed, and thereafter perform a mainband training of the mainband interface at a negotiated data rate. Other embodiments are described and claimed.

Link initialization training and bring up for die-to-die interconnect

In an embodiment, an apparatus includes a receiver circuit to: in response to a determination that the receiver circuit is in a high latency processing mode, transmit a hint signal to a transmitter circuit; receive a response message from the transmitter circuit; process the response message to reduce a current workload of the receiver circuit; and switch the receiver circuit from the high latency processing mode to a low latency processing mode. Other embodiments are described and claimed.

Selection of processing mode for receiver circuit

Embodiments herein relate to action that are to be taken on various lanes of a die-to-die (D2D) interconnect in the event of clock-gating. Specifically, based on identification that a clock-gating event is to occur, physical layer (PHY) logic may direct PHY electrical circuitry to set the state of various of the lanes. In some embodiments, different actions may be taken based on whether the D2D interconnect is terminated or unterminated. Other embodiments may be described and claimed.

Clock-gating in die-to-die (D2D) interconnects

A port is to couple to another die over a die-to-die (D2D) link and includes a die-to-die (D2D) adapter to determine, from a set of registers, a set of capabilities of the D2D adapter to advertise in a negotiation with a link partner D2D adapter, where the D2D adapter is on a die and the link partner D2D adapter is located on a remote link partner die. A first capabilities advertisement message is sent to the link partner D2D adapter to advertise the set of capabilities to the link partner D2D adapter. A second capabilities advertisement message is received from the link partner D2D adapter, wherein the second capabilities advertisement message identifies a set of capabilities of the link partner D2D adapter. A final configuration of a D2D link is determined to couple the die to the link partner die.

Parameter exchange for a die-to-die interconnect

In one embodiment, an apparatus comprises a first die that includes: a die-to-die adapter comprising a plurality of first registers, the die-to-die adapter to communicate with protocol layer circuitry via a flit-aware die-to-die interface (FDI) and physical layer circuitry via a raw die-to-die interface (RDI), wherein the die-to-die adapter is to receive message information of a first interconnect protocol; and the physical layer circuitry coupled to the die-to-die adapter, the physical layer circuity comprising a plurality of second registers, where the physical layer circuitry is to receive and output the message information to a second die via an interconnect having a mainband and a sideband. During a test of the apparatus, the sideband is to enable access to information in at least one of the plurality of first registers or at least one of the plurality of second registers. Other embodiments are described and claimed.

Compliance and debug testing of a die-to-die interconnect

A port is to couple to another die over a die-to-die (D2D) link and includes physical layer (PHY) circuitry including a first number of sideband lanes to carry data for use in training and management of the D2D link, and a second number of mainband lanes to implement a main data path of the D2D link. The mainband lanes include a forwarded clock lane, a valid lane, and a plurality of data lanes. A logical PHY coordinates functions of the sideband lanes and the mainband lanes.

Die-to-die interconnect

A device includes a port with a replay buffer and protocol logic to receive a flit in a sequence of flits to be sent on a point-to-point link and determine an error in the flit. Based on the error, a copy of the flit is stored in a first position within the replay buffer as well as a copy of a next flit received in the sequence of flits, which is stored in a second position within the replay buffer. The copies of the flits are then written to a register for access by software.

Hardware logging for lane margining and characterization

In one embodiment, an apparatus includes: a die-to-die adapter to communicate with protocol layer circuitry and physical layer circuitry; and the physical layer circuitry coupled to the die-to-die adapter, where the physical layer circuitry is to receive and output first information to a second die via an interconnect. The physical layer circuitry may include: a first sideband data receiver to couple to a first sideband data lane and a first sideband clock receiver to couple to a first sideband clock lane; and a second sideband data receiver to couple to a second sideband data lane and a second sideband clock receiver to couple to a second sideband clock lane. The physical layer circuitry may assign a functional sideband comprising: one of the first or second sideband data lanes; and one of the first or second sideband clock lanes. Other embodiments are described and claimed.

Sideband interface for die-to-die interconnects

A single communication fabric for a data processing apparatus is provided. The fabric has an interconnection network to provide a topology of data communication channels between a plurality of data-handling functional units. The interconnection network has a first interconnection domain to provide data communication between a first subset of the data-handling functional units and a second interconnection domain to provide data communication between a second subset of the data-handling functional units. The power management circuitry is arranged to control a first performance level for the first interconnection domain independently from control of a second performance level for the second interconnection domain. Machine readable instructions and a method are provided to concurrently set performance levels of two different fabric domains to respective different operating frequencies.

Performance level control in a data processing apparatus

A FEC codec for generating a check byte for a message. The FEC codec includes a port encoder having a storage unit, a Galois field multiplier, and a sum unit. The storage unit stores a first staged result, which is accumulated based on previous sets of input byte of the message for all clock cycles from a first clock cycle to a clock cycle immediately prior to the current clock cycle. The Galois field multiplier performs a Galois field multiplication of the first staged result and a power of the alpha to generate a Galois field product. The sum unit performs a Galois field addition on an internal input based on a consolidated byte for the current clock cycle and the Galois field product to generate a second staged result for subsequent use to generate the check byte. Other embodiments may be described and/or claimed.

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Mountain View, CA, United States of America

Swadesh Choudhary