Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Osram Opto Semiconductor Gmbh

Sven Weber-Rabsilber

Peter Brick

Daniel Richter

Francis Nguyen

John McNatt

Michael Zitzlsperger

Michael Wittmann

Stefan Gruber

Nadir Farchtchian

Marcel Severin

Naceur Chaabane

John Mcnatt

A method for operating a visual display apparatus is specified. The apparatus comprises a first optoelectronic semiconductor component configured to emit electromagnetic radiation of a first wavelength and comprising a first intrinsic switch-on delay. The apparatus comprises a second optoelectronic semiconductor component configured to emit electromagnetic radiation of a second wavelength and comprising a second intrinsic switch-on delay. The second wavelength is different from the first wavelength. The first semiconductor component is operated with a first operating current according to a first actuation signal. The second semiconductor component is operated with a second operating current according to a second actuation signal. The first and/or the second actuation signal comprise a delay clock signal selected such that emissions of electromagnetic radiation from the first and second semiconductor components comprise a switch-on delay with respect to each other that is smaller than a difference of the first and second intrinsic switch-on delays.

Method and display device for reducing switch-on delay between different light emission components

An optoelectronic semiconductor component may include a housing having a recess, and a chip carrier which is a part of the housing. The chip carrier may have a first fastening side and an upper side. The optoelectronic semiconductor chip may be mounted on the upper side in the recess. First electrical contact pads for external electrical contacting may be located on the first fastening side. Furthermore, second electrical contact pads for external electrical contacting may be located on a second fastening side, opposite to the first fastening side, of the housing. First and second electrical contact pads electrically assigned to one another may be electrically short-circuited so that the semiconductor component can be electrically contacted by the first or by the second fastening side.

Optoelectronic semiconductor component and assembly having an optoelectronic semiconductor component

A light-emitting diode includes at least one light-emitting diode chip, a carrier for the at least one light-emitting diode chip, and at least one control device integrated into the carrier, wherein each of the light-emitting diode chips is electrically connected to one of the at least one control devices, each of the at least one control devices includes a data storage device in which brightness data for each light-emitting diode chip which is connected to the control device is stored, and the control device drives the connected light-emitting diode chip with a current which is selected according to stored brightness data for the light-emitting diode chip.

Light-emitting diode and method of producing a light-emitting diode

A light-emitting diode includes at least one light-emitting diode chip, at least one control device, wherein each of the light-emitting diode chips is electrically connected to one of the at least one control devices, each of the at least one control devices including a data storage device in which brightness data for each light-emitting diode chip which is connected to the control device is stored, and the control device drives the connected light-emitting diode chip with a current which is selected according to stored brightness data for the light emitting-diode chip.

Light-emitting diode and method for producing a light-emitting diode

In at least one embodiment, an optoelectronic semiconductor component includes at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation in mutually different wavelength ranges when in operation. The semiconductor chips are mounted on a mounting surface of a common carrier. Furthermore, the optoelectronic semiconductor component contains at least two non-rotationally symmetrical lens bodies, which are designed to shape the radiation into mutually different emission angles in two mutually orthogonal directions parallel to the mounting surface. One of the lens bodies is here associated with or arranged downstream of each of the semiconductor chips in an emission direction.

Optoelectronic semiconductor component and display means

An optoelectronic device includes at least one luminescence diode chip which emits electromagnetic radiation during operation of the optoelectronic device, and at least one shield against stray radiation which laterally surrounds the luminescence diode chip only in places, wherein each shield is integral with a component of the optoelectronic device.

Optoelectronic device

An optoelectronic semiconductor component includes a basic body, at least one semiconductor chip arranged thereon, and an encapsulation embedding the at least one semiconductor chip and composed of a radiation-transmissive material with scattering particles. A radiation-transmissive covering layer with an absorber is applied to the encapsulation.

Optoelectronic semiconductor component

In a light-emitting diode carrier, a plurality of light-emitting diodesare mounted on the rear sideof the light-emitting diode carrier and project into a plurality of openings. During operation, the light-emitting diodesradiate through the openingsof the light-emitting diode carrier. A filmis applied on the front sideof the light-emitting diode carrier, said film being transmissive to the radiation emitted by the light-emitting diodes and protecting the light-emitting diode carrier from ambient influences.

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Neutraubling, Germany

Sven Weber-Rabsilber