Nxp B.v.

Sven Walczyk

Roelf Anco Jacob Groenhuis

Rolf Brenner

Tim Boettcher

Emiel De Bruin

Emiel Bruin

Disclosed is a discrete semiconductor device package () comprising a semiconductor die () having a first surface and a second surface opposite said first surface carrying a contact (); a conductive body () on said contact; an encapsulation material () laterally encapsulating said conductive body; and a capping member () such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap () may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.

Discrete semiconductor device package and manufacturing method

Aspects of the present invention are directed to circuits, circuit packages and related methods. In accordance with various example embodiments, respective electrodes are implemented to facilitate contact to a semiconductor device via different surfaces and/or sidewalls, as may be useful in connecting the device to an external package having a plurality of semiconductor devices in which same-surface connections to the devices are spatially restricted. The semiconductor device has opposing surfaces and sidewalls connecting the surfaces, and contacts to respective different regions in the device. Respective electrodes are coupled to the respective contacts and extend along/around the device to provide access to the contacts via different surfaces.

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Waalre, Netherlands

Sven Walczyk