Nexperia B.v.

Sven Walczyk

Kan Wae Lam

Pompeo V Umali

Chi Ho Leung

Shun Tik Yeung

Hans-Juergen Funke

Harrie Martinus Maria Horstink

Wai Keung Ho

Wing Onn Chaw

Wai Hung William Hor

Xue Ke

Thierry Jans

Paul Pang Hing Tsang

Stevechifai Lee

Fei-Ying Wong

Tim Boettcher

Bernd Rohrmoser

Markus Bjoern Erik Noren

Pompeo Umali

This disclosure relates to a flank wettable semiconductor device, having: a lead frame including a plurality of leads with a lead end portion and a semiconductor die mounted on the lead frame. The lead end portion comprises a recess portion having a height that corresponds to a thickness of the lead end portion, and a plate member mounted on the leadframe at the lead end portion.

Through hole side wettable flank

A semiconductor die has internal circuitry formed on two more internal layers, and die bonding pads arranged on a top surface of the die. The bonding pads are connected to the internal circuitry for providing input and output signals to the internal circuitry. One or more connecting lines electrically connect one or more pairs of the die bonding pads, thereby defining a bonding pad layout. The die bonding pads are arranged and connected with the connecting lines such that the bonding pad layout is reversible, which allows the die to be used in different package types (e.g., TSSOP or DFN) yet maintain a standardized pin arrangement without the necessity for long or crossed bond wires.

Reversible semiconductor die

A semiconductor device has wettable corner leads. A semiconductor die is mounted on a lead frame. Die bonding pads are electrically connected to leads of the lead frame. The die and electrical connections are encapsulated with a mold compound. The leads are exposed and flush with the corners of the device. The leads include dimples so that they are wettable, which facilitates inspection when the device is mounted on a circuit board or substrate.

Semiconductor device with wettable corner leads

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Nijmegen, Netherlands

Sven Walczyk