Evatec Ag

Oerlikon Advanced Technologies Ag

Sven Uwe Rieschl

Juergen Weichart

Mohamed Elghazzali

Jurgen Weichart

Jürgen Weichart

Apparatus for depositing a layer on a substrate in a process gas includes a chuck containing a first surface for supporting the substrate, a clamp for securing the substrate to the first surface of the chuck, an evacuatable enclosure enclosing the chuck and the clamp and control apparatus. The evacuatable enclosure includes an inlet, through which the processing gas is insertable into the enclosure. The control apparatus is adapted to move at least one of the chuck and the clamp relative to, and independently of, one another to adjust a spacing between the chuck and the clamp during a single deposition process while maintaining a flow of the processing gas and a pressure within the enclosure that is less than atmospheric pressure.

Apparatus for depositing a layer on a substrate in a processing gas

So as to control the operation of a sputter target during the lifetime of the target and under HIPIMS operation, part of a magnet arrangement associated to the target is retracted from the target whereas a second part II of the magnet arrangement is, if at all, retracted less from the addressed backside during the lifetime of the target. Thereby, part I is closer to the periphery of target than part II, as both are eccentrically rotated about a rotational axis.

Method of sputtering and sputter system

So as to control the operation of a sputter target () during lifetime of the target and under HIPIMS operation part (I) of a magnet arrangement associated to the target () is retracted from the target () whereas a second part II of the magnet arrangement is, if at all, retracted less from the addressed backside () during lifetime of the target (). Thereby, part I is closer to the periphery of target () than part II, as both are eccentrically rotated about a rotational axis (A).

Method of HIPIMS sputtering and HIPIMS sputter system

Apparatus () for depositing a layer () on a substrate () in a process gas comprises a chuck () comprising a first surface () for supporting the substrate (), a clamp () for securing the substrate () to the first surface () of the chuck (), an evacuatable enclosure () enclosing the chuck () and the clamp () and comprising an inlet, through which the processing gas is insertable into the enclosure (), and control apparatus (). The control apparatus () is adapted to move at least one of the chuck () and the clamp () relative to, and independently of, one another to adjust a spacing between the chuck () and the clamp () during a single deposition process while maintaining a flow of the processing gas and a pressure within the enclosure () that is less than atmospheric pressure.

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Malans, Switzerland

Sven Uwe Rieschl