Average Co-Inventor Count = 1.28
ph-index = 6
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Micron Technology Incorporated (24 from 37,905 patents)
2. Marian Corporation (1 from 2 patents)
25 patents:
1. 6921017 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
2. 6817823 - Method, device and system for semiconductor wafer transfer
3. 6709967 - Laser wire bonding for wire embedded dielectrics to integrated circuits
4. 6634538 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
5. 6588649 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
6. 6390853 - Laser wire bonding for wire embedded dielectrics to integrated circuits
7. 6375061 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
8. 6352191 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
9. 6211053 - Laser wire bonding for wire embedded dielectrics to integrated circuits
10. 6159609 - Method and apparatus for applying atomized adhesive to a leadframe for
11. 6138891 - Non-conductive and self-leveling leadframe clamp insert for wirebonding
12. 6132798 - Method for applying atomized adhesive to a leadframe for chip bonding
13. 6129039 - Apparatus for applying atomized adhesive to a leadframe for chip bonding
14. 6126062 - Non-conductive and self-leveling leadframe clamp insert for wirebonding
15. 6105846 - Non-conductive and self-leveling leadframe clamp insert for wirebonding