Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Semikron Elektronik Gmbh &co.kg

Sven Berberich

Martin Maerz

Vincent Lorentz

Holger Schwarzmann

Martin März

Arendt Wintrich

A method for producing a plurality of integrated semiconductor components on a carrier, in which an active basic structure is introduced into the carrier in a continuous fashion at least across a portion of the boundaries of the semiconductor components to be created. The regions of the semiconductor components on the carrier are defined, and a covering layer is applied to the carrier in the region of each semiconductor component with the aid of a mask. The carrier is severed to form the individual semiconductor components at the boundaries thereof.

Method for producing a plurality of integrated semiconductor components

A method of sensing a current within a coil, said current being applied to the coil such that it is switched via a switching transistor, includes a detection transistor, a circuit and a control element. The detection transistor is configured to sense the current. The circuit is configured to provide, at a predetermined point in time during a current sensing period, a voltage across the switching transistor. The control element is configured to match, in response to the voltage provided by the circuit, the working points of the switching transistor and of the detection transistor, and to output an output signal which corresponds to the current to be sensed.

Apparatus and method for sensing a current within a coil

A layer assemblage for a semiconductor chip having a chip body for producing a soldering connection for the chip. The assemblage is provided on a side of a chip body formed from a semiconducting material, wherein the layer assemblage is formed from a plurality of sequential metal layers which follow one above another and are produced by means of a physical coating method, and wherein a solderable soldering layer is provided between a noble metal layer situated at a surface of the layer assemblage and the chip body. In order to avoid an undesired penetration of a solder through the layer assemblage the soldering layer has at least one internal interface formed by an interruption of the coating method.

Layered chip for use in soldering

A device for switching an electric signal having a first member having a p-doped area with a first terminal and an n-doped area with a second terminal and a second member coupled to the first member to cause a mechanical deformation of the first member in an area of a transition from the p-doped area into the n-doped area.

Device and method for switching electric signals and powers

Integrated snubber device on a semiconductor basis for wiring an electric network for absorbing electric energy from an electric energy store, of an electric network, including at least two terminals for being connected to the electric network to be wired, an electric resistor structure, and a reactance structure, which are connected between the terminals.

Integrated snubber device on a semiconductor basis for switching load reduction, voltage limitation and/or oscillation attenuation

A circuit element for protecting a load circuit includes a signal input for applying a signal, a signal output, a signal path connecting the signal input to the signal output, and an interruption means for irreversibly interrupting the signal path upon the reception of a control signal at the same.

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Spardorf, Germany

Sven Berberich