Matsushita Electric Industrial Co., Ltd.

Suzushi Kimura

Yuji Mido

Katsumasa Miki

Tatsuo Fujii

Tsuyoshi Himori

Koji Hashimoto

Tetsuhiro Korechika

Makoto Nakano

Hiroshi Yamaguchi

Hideyuki Okinaka

Keiichi Nakao

Kouji Kawakita

Seiji Takagi

Yasuhiko Hakotani

Koji Shimoyama

Koichi Kojima

Hideki Masumi

Youichiro Yokotani

Naotugu Yoneda

Mariko Ishikawa

Seiichi Nakatani

Yoshihiro Bessho

Satoru Yuhaku

Minehiro Itagaki

Hiroshi Kushitani

Tomio Yoshida

Naoki Yuda

Hidenori Katsumura

Tsunenori Yoshida

Shigeo Furukawa

Kazuhiro Miura

Kazuyuki Okano

Masahiro Hiraka

Tsutomu Inuzuka

Ryuichi Saito

Munehiro Tabata

Yoshitake Hayashi

Tadashi Kawamata

Satoshi Tomioka

Yuji Midou

Masaaki Ueda

Osamu Tabata

Shigeo Hurukawa

Hideyuki Orinaka

Koji Kawakita

Seiji Gejima

Saburo Kimura

Yufuko Toyonaga

A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.

Capacitor

According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the first molding die with resin with a first end electrode of the chip component exposed; a peeling step of peeling the first molding die at a side of inserting the chip component; a secondary molding step of filling a second molding die with resin with a second end electrode of the chip component; and a forming step of forming a circuit wiring on one side or both sides of a molded element molded with resin, wherein the chip component is disposed according to a specified rule, and the chip component is molded with the resin.

Method of forming a module component having a plurality of penetration holes

A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.

Electrolytic capacitor and method for manufacturing the same

The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same. According to the invention, since a desired circuit is composed by disposing a specific number of chip components according to a specified rule, it is not necessary to heat the buried chip components at high temperature when forming a module, chip components are obtained in specified values, and the circuit characteristics, functions, and dimensional precision are stably obtained exactly as designed, and moreover since the chip components are disposed according to a specified rule, it is easy to automate insertion of chip components and increase its operation speed, even if the size of the chip components is reduced, and the circuit composition may be flexibly and easily changed only by changing the inserting position and type of chip components.

Module component and method of manufacturing the same

A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foilis made porous in one of the surfaces, a dielectric layeris formed on the porous portion, a through holeis provided in the aluminum foilat a certain specific location. An insulation layeris formed to cover the other surface, viz. non-porous surface, of the aluminum foiland the inner wall surface of through hole, a solid electrolytic layeris provided on the dielectric layer, and a through hole electrodeis formed in the through hole, and then a collector layeris formed on the solid electrolytic layer. The insulation layerdisposed on aluminum foilis provided with an openingat a certain specific location, and a connection terminalis provided at the openingof insulation layerand the exposed surface of the through hole electrode, respectively.

Method for producing solid electrolytic capacitor

A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foilis provided on one surface with a resist filmand then with a through hole. Next, an insulation filmis formed to cover the other surface of aluminum foiland to fill the first through hole, and then the resist filmis removed; and then the surface of aluminum foilis roughened to be provided with a dielectric layerthereon. A second through holeis formed in the insulation film, which is filling the first through hole. A through hole electrodeis formed in the second through hole; and then, on the surface of the dielectric layer, a solid electrolytic layerand a collector layerare formed. After an openingis provided, a first connection terminalis formed therein, and a second connection electrodeon the exposed surface of the through hole electrode

Method for manufacturing solid electrolytic capacitor

A solid electrolytic capacitor includes a bulb-metal sheet of which first face has a porous section. A dielectric film, a solid electrolyte layer, and a current-collecting layer are formed in this order on the porous section. On top of the current-collecting layer, a reinforcing plate is bonded. A second face opposite to the first face of the sheet has a connecting terminal conductive to the current-collecting layer. This connecting terminal is coupled to a through-hole electrode which extends through the bulb-metal sheet for appearing outside the second face. The second face has another connecting terminal conductive to the bulb-metal sheet. This structure makes the capacitor thin, and allows the capacitor to increase its stress-resistance and be excellent in responsiveness to a high frequency as well as in mounting convenience.

Solid electrolytic capacitor and manufacturing method of the same

A method of manufacturing solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet ( ) is made porous and a dielectric coating ( ) is provided on the porous face ( ); an element forming stage where a solid electrolytic layer ( ) and a collector layer ( ) are formed on the dielectric coating ( ); and a terminal forming stage where a connecting terminal ( ) for connecting to an external electrode is formed. The element forming stage includes the steps of forming the solid electrolytic layer ( ); a forming through-hole electrode ( ) in a through-hole ( ) that is prepared on the valve metal sheet ( ); and forming the collector ( ) on the solid electrolytic layer ( ).

Method of manufacturing solid-state electrolytic capacitor

The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet has dielectric layer and current collector layer formed on the surface thereof, and is packaged by insulators and The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.

Circuit module

A dielectric layer is formed on a surface of a porous portion formed at least on a surface of a valve metal sheet. A solid electrolyte layer is formed on the dielectric layer, and a collector layer is formed on the solid electrolyte layer. A first insulating portion is formed on an outer periphery of the dielectric layer, and a solid electrolyte layer is formed on a portion of the dielectric layer corresponding to an opening of the first insulating portion. A portion of the solid electrolyte layer is formed on the first insulating portion. A second insulating portion is formed on the first insulating portion and on the outer periphery of the solid electrolyte layer. A collector layer is formed on a surface of the solid electrolyte layer exposed through an opening of the second insulating portion, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has less current leakage and a high withstand voltage.

Solid electrolytic capacitor and method of manufacturing capacitor

A solid electrolytic capacitor having a high capacitance and excellent high frequency response including a valve metal sheet which is made porous, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer and an electrode exposure area formed on the solid electrolyte layer, and an insulating section electrically insulating the electrode exposure area from the collector layer, in which the electrode exposure area and the collector layer are formed on the same surface of the valve metal sheet.

Solid electrolytic capacitor and method of manufacturing the capacitor

A solid electrolytic capacitor of the present invention includes a sheet of valve metal, of which a part constitutes an positive electrode, a dielectric layer formed on a surface of the valve metal, a solid electrolyte layer formed on the dielectric layer, a negative electrode formed on the solid electrolyte layer, and an insulating protective layer for protecting the positive electrode, the dielectric layer, the solid electrolyte layer and the negative electrode. It is further provided with a bump formed on the insulating protective layer and connected to at least one of the positive electrode and the negative electrode. The solid electrolytic capacitor of the present invention is useful to constitute a semiconductor device or a circuit having outstanding high frequency response.

Solid electrolyte capacitor

A capacitor comprising a porous metal sheet, part of which forms an electrode section, an organic dielectrics formed on a metal surface, a solid electrolyte layer formed on the organic dielectrics, an electrode layer formed on the solid electrolyte layer, and an insulating protection layer provided for protecting said electrode section, dielectrics, solid electrolyte layer and electrode layer. The capacitor is provided with bumps, which are formed on the insulating protection layer and connected at least with the electrode section or the electrode layer. The capacitor of the present invention provides a semiconductor device or a circuit superior in the high frequency response.

A diplexer employed in mobile communications equipment such mobile phones which can divide signals into two channels with a simple configuration without interfering the other band. In this diplexer, an inductor is connected between a &pgr;-type three-stage one polar low-pass filter and a common terminal as a first matching circuit, and a capacitor A is connected between a one polar band-pass filter and a common terminal as a second matching circuit so that interference with the other band can be prevented and the higher harmonics can be sufficiently attenuated with simple configuration.

Diplexer duplexer and two-channel mobile communications equipment

Growing community of inventors

Osaka, Japan

Suzushi Kimura