Artesyn Embedded Computing, Inc.

Smart Embedded Computing, Inc.

Motorola Corporation

Emerson Network Power - Embedded Computing, Inc.

Suzanne Marye Wong

Martin Peter John Cornes

Robert Charles Tufford

Douglas L Sandy

Ross L Armstrong

Henry Wong

Thomas J Bertram

Patrick J Richardson

Kendra Renee Konopka

George Paul Zemke

A housing assembly for a solid state drive (SSD) includes a carrier cage configured to be fixed to a riser board, the carrier cage including a peripheral wall having at least one carrier slot. A carrier tray configured to house the SSD includes an interior compartment at least partially defined by the walls of the carrier tray. A first fixture is disposed at a first end of the carrier tray to engage the SSD. A second fixture is disposed at the second end of the carrier tray, opposite the first end, to engage the SSD, wherein the carrier tray is removably disposed within the carrier slot of the carrier cage.

Carrier for one or more solid state drives (SSDs)

A configurable electronics cabinet cooling system includes a cabinet having multiple walls including at least one universal cabinet wall. The universal cabinet wall has a planar outward facing surface and multiple apertures. A heat transfer component is releasably connected to the universal cabinet wall. The heat transfer component is selected from either a conductive cooling member or a convective cooling member each adapted to be interchangeably and releasably connected to the universal cabinet wall using fasteners extending through same ones of the apertures. Each of the conductive cooling member and the convective cooling member includes a planar surface, the planar surface adapted to directly contact the outward facing surface of the universal cabinet wall.

Configurable cooling for rugged environments

An electrical equipment cabinet cooling device includes an electrical equipment cabinet having a cabinet outer frame defining an inner perimeter wall. A planar outer cabinet wall is positioned within the inner perimeter wall. A two-phase thermal device includes spaced and opposed first and second transfer walls. An outer perimeter wall connects the first and second transfer walls and defines an interior sealed cavity between the first and second transfer walls. The outer perimeter wall is sized for slidable receipt within the inner perimeter wall. A liquid/vapor retained in the interior sealed cavity acts as a heat transfer medium between the first and second transfer walls. A convective cooling block has a planar end face in direct contact with the second transfer wall. Heat transfers to atmosphere in a path including the outer cabinet wall, the first transfer wall, the liquid/vapor, the second transfer wall, and the cooling block.

Method and device to provide uniform cooling in rugged environments

A canister system having a cylindrical housing and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system includes a thermal contact member that is in at least selective physical contact with an interior surface of the cylindrical housing to permit conductive heat transfer there through. An input/output device extends along at least a portion of the modular electronic rack system and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots disposed at a position generally along the modular electronic rack system is provided.

Thermal conduction to a cylindrical shaft

A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slidably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.

Integrated thermal inserts and cold plate

A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slideably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.

A canister system having a cylindrical housing, having at least one enclosed end, and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system including an input/output device extending along at least a portion of the modular electronic rack system. The modular electronic rack system further having a power input and a signal output electrically coupled to the input/output device&#x2014;at least one of the power input and the signal output extending through the at least one enclosed end of the cylindrical housing at a first sealed terminal. The canister system further having a first alignment system for physically aligning an electronic connection with the sealed terminal. The electronic connection having physically engaging features extending from the cylindrical housing to align the electronic connection therewith.

Alignment mechanism for cabling to a cylinder head

A circuit board assembly for installation in a cabinet includes a first standards based size first mounting frame portion having a PCB mounted thereto. A second mounting frame portion is connected to the first mounting frame portion having no portion of the PCB connected thereto. A combination size of the first and second mounting frames defines a larger second standards based size. Multiple heat transfer components may be connected to the first or second mounting frame portion provide a conduction/convection cooling path. The first mounting frame portion may include a first false board edge and the second mounting frame portion includes one or more false board edge(s) positioned laterally and oppositely directed to the first false board edge. The first and second false board edges are slidably received in opposed slots created in a cabinet.

Extended heat frame for printed circuit board

A ruggedized canister system having a cylindrical housing and a modular electronic rack system disposed therein. The modular electronic rack system includes a backplane and a plurality of rib members radiating outwardly from the backplane. The rib members extend from the backplane at a proximal end in a direction generally orthogonal to the longitudinal axis of the backplane toward a distal end. An input/output device extends along at least a portion of the backplane and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots are positioned within a space define by the rib members when viewed in plan view. Each of the electronic slots is configured to physically and operably receive an electronic card. Each of the electronic slots is electrically connected to the input/output device for electrical communication between the electronic card and the input/output device.

Modular electronics for cylinders

A rear transition module () includes a connector () in an RP0 mechanical envelope (), and an RTM alignment and keying mechanism () in the RP0 mechanical envelope of the rear transition module that uniquely corresponds to a first signal path configuration () in a corresponding connector () on a backplane () of a VXS multi-service platform system chassis (), where the rear transition module is coupled to operate within the VXS multi-service platform system chassis having a VMEbus network () and a switched fabric () coincident on the backplane.

RTM alignment and keying mechanism

An apparatus including a front panel () and a bezel () coupled to the front panel () and having a gasket (), where the gasket () is affixed to the bezel () and electrically couples the bezel () to the front panel (). Bezel () can be a mezzanine card bezel, a common mezzanine card bezel, and the like. A method of electrically coupling a front panel () to a bezel () includes providing a front panel () having an inner surface () defining a cut-out (). Also, providing a bezel () having a perimeter (), where the inner surface () of the cut-out () is designed to receive the bezel (). Affixing a gasket () to the perimeter () of bezel () an the inner surface () receiving the bezel () where the gasket () is designed to be coupled to the inner surface (), and electrically coupling the bezel () to the front panel () through the gasket ().

Growing community of inventors

Tempe, AZ, United States of America

Suzanne Marye Wong